Supporting plate, apparatus, and method for stripping supporting plate

Abstract

A supporting plate which makes it possible to easily strip the supporting plate from a substrate in a short period of time after thinning the substrate. In the supporting plate to which a circuit-formed surface of a substrate is bonded with an adhesive, a first penetrating hole is formed in a substantially central portion of the supporting plate in the thickness direction, grooves connecting with the first penetrating hole are formed on a surface of the supporting plate to be contacted with an adhesive, and a second penetrating hole connecting with the grooves is formed in a peripheral portion of the supporting plate in the thickness direction.

1 . A supporting plate to which a circuit-formed surface of a substrate is bonded with an adhesive, 
 wherein a first penetrating hole is formed in a substantially central portion of the supporting plate in the thickness direction, grooves connecting with the first penetrating hole are formed on a surface of the supporting plate to be contacted with an adhesive, and a second penetrating hole connecting with the grooves is formed in a peripheral portion of the supporting plate in the thickness direction.    
   
   
       2 . The supporting plate according to  claim 1 , wherein the grooves are in a grid, staggered, or form a honeycomb pattern.  
   
   
       3 . The supporting plate according to  claim 1 , wherein the first penetrating hole is a hole for supplying a solvent, and the second penetrating hole is a hole for draining the solvent.  
   
   
       4 . The supporting plate according to  claim 1 , wherein the second penetrating hole is a hole for supplying a solvent, and the first penetrating hole is a hole for draining the solvent.  
   
   
       5 . An apparatus for stripping a supporting plate bonded to a circuit-formed surface of a substrate with an adhesive, comprising a plate which has a first penetrating hole formed in a substantially central portion of the plate in the thickness direction, a second penetrating hole formed in a peripheral portion of the plate in the thickness direction, and a hole for attracting a supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction.  
   
   
       6 . The apparatus according to  claim 5 , wherein the first penetrating hole is a hole for supplying a solvent, and the second penetrating hole is a hole for draining the solvent.  
   
   
       7 . The apparatus according to  claim 5 , wherein the second penetrating hole is a hole for supplying a solvent, and the first penetrating hole is a hole for draining the solvent.  
   
   
       8 . The apparatus according to  claim 6 , wherein the first penetrating hole is also a hole for supplying air from an air supplying means.  
   
   
       9 . A method for stripping a supporting plate bonded to a circuit-formed surface of a substrate with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate, comprising the steps of: 
 supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate in the thickness direction thereof;    distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate;    dissolving the adhesive on the surface contacted with the substrate by the solvent; and    draining the solvent used for dissolving the adhesive from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate in the thickness direction and a second penetrating hole formed in a peripheral portion of the plate.    
   
   
       10 . The method according to  claim 9 , further comprising the step of supplying air from outside to the first penetrating hole of the plate so as to distribute the air from the first penetrating hole of the supporting plate to the grooves which connect with the first penetrating hole of the supporting plate after the step of dissolving the adhesive.  
   
   
       11 . A method for stripping a supporting plate bonded to a circuit-formed surface of a substrate with an adhesive by using a plate which has a first penetrating hole formed in one of a substantially central portion and a peripheral portion thereof in the thickness direction, a second penetrating hole formed in the other of the substantially central portion and the peripheral portion thereof and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate, comprising the steps of: 
 supplying a solvent from outside to the fist penetrating hole of the plate and to an associated first penetrating hole formed in one of a substantially central portion and a peripheral portion of the supporting plate in the thickness direction thereof;    distributing the solvent from the first penetrating hole of the supporting plate to grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate;    dissolving the adhesive on the surface contacted with the substrate by the solvent; and    draining the solvent used for dissolving the adhesive from a second penetrating hole formed in the other of the substantially central portion and the peripheral portion of the supporting plate of the supporting plate and the second penetrating hole of the plate.    
   
   
       12 . The method according to  claim 11 , further comprising the step of supplying air from outside to the second penetrating hole of the plate so as to distribute the air from the second penetrating hole of the supporting plate to the grooves which connect with the second penetrating hole of the supporting plate after the step of dissolving the adhesive.  
   
   
       13 . The supporting plate according to  claim 2 , wherein the first penetrating hole is a hole for supplying a solvent, and the second penetrating hole is a hole for draining the solvent.  
   
   
       14 . The supporting plate according to  claim 2 , wherein the second penetrating hole is a hole for supplying a solvent, and the first penetrating hole is a hole for draining the solvent.  
   
   
       15 . The apparatus according to  claim 7 , wherein the first penetrating hole is also a hole for supplying air from an air supplying means.  
   
   
       16 . The supporting plate according to  claim 1 , including more than one said first penetrating formed in the substantially central portion of the supporting plate and more than one said second penetrating formed in the peripheral portion of the supporting plate.  
   
   
       17 . The supporting plate according to  claim 16 , wherein said more than one said second penetrating are formed in spaced relation around the peripheral portion of the supporting plate.  
   
   
       18 . The apparatus according to  claim 5 , including more than one said first penetrating formed in the substantially central portion of the plate and more than one said second penetrating formed in the peripheral portion of the plate.  
   
   
       19 . The apparatus according to  claim 18 , wherein said more than one said second penetrating are formed in spaced relation around the peripheral portion of the plate.