Inventor · disambiguated record
Murali Narasimhan
Also filed as: NARASIMHAN MURALI · NARASIMHAN MURALI K
25 granted patents·8 pending applications·944 citations·filing 1995–2020
97Inventor score
Top patents by PatentIndex Score
33 records- 0197US6432819B1Method and apparatus of forming a sputtered doped seed layerAPPLIED MATERIALS INC·Filed 1999·Granted Aug 13, 2002·302 cites·1 claims
- 0297US6122921AShield to prevent cryopump charcoal array from shedding during cryo-regenerationAPPLIED MATERIALS INC·Filed 1999·Granted Sep 26, 2000·151 cites·21 claims
- 0394US11244844B2High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methodsAPPLIED MATERIALS INC·Filed 2019·Granted Feb 8, 2022·11 cites·25 claims
- 0489US9209074B2Cobalt deposition on barrier surfacesAPPLIED MATERIALS INC·Filed 2015·Granted Dec 8, 2015·5 cites·20 claims
- 0589US6139701ACopper target for sputter depositionAPPLIED MATERIALS INC·Filed 1999·Granted Oct 31, 2000·85 cites·40 claims
- 0688US6391163B1Method of enhancing hardness of sputter deposited copper filmsAPPLIED MATERIALS INC·Filed 2000·Granted May 21, 2002·37 cites·20 claims
- 0788US6042700AAdjustment of deposition uniformity in an inductively coupled plasma sourceAPPLIED MATERIALS INC·Filed 1997·Granted Mar 28, 2000·77 cites·21 claims
- 0886US8617985B2High temperature tungsten metallization processAPPLIED MATERIALS INC·Filed 2012·Granted Dec 31, 2013·7 cites·19 claims
- 0984US9051641B2Cobalt deposition on barrier surfacesLU JIANG·Filed 2008·Granted Jun 9, 2015·8 cites·25 claims
- 1082US6001227ATarget for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such targetAPPLIED MATERIALS INC·Filed 1997·Granted Dec 14, 1999·40 cites·30 claims
- 1180US8835311B2High temperature tungsten metallization processAPPLIED MATERIAL INC·Filed 2013·Granted Sep 16, 2014·4 cites·19 claims
- 1277US5972178AContinuous process for forming improved titanium nitride barrier layersAPPLIED MATERIALS INC·Filed 1995·Granted Oct 26, 1999·52 cites·6 claims
- 1373US8642473B2Methods for contact cleanCHANG MEI·Filed 2012·Granted Feb 4, 2014·4 cites·23 claims
- 1472US6315872B1Coil for sputter depositionAPPLIED MATERIALS INC·Filed 1999·Granted Nov 13, 2001·20 cites·9 claims
- 1569US7050160B1Process and apparatus for integrating sheet resistance measurements and reflectance measurements of a thin film in a common apparatusKLA TENCOR TECH CORP·Filed 2003·Granted May 23, 2006·8 cites·24 claims
- 1668US6077353APedestal insulator for a pre-clean chamberAPPLIED MATERIALS INC·Filed 1998·Granted Jun 20, 2000·35 cites·18 claims
- 1767US6228186B1Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomaliesAPPLIED MATERIALS INC·Filed 1999·Granted May 8, 2001·23 cites·37 claims
- 1866US6372301B1Method of improving adhesion of diffusion layers on fluorinated silicon dioxideAPPLIED MATERIALS INC·Filed 1998·Granted Apr 16, 2002·25 cites·27 claims
- 1964US9305838B2BEOL interconnect with carbon nanotubesNARWANKAR PRAVIN K·Filed 2012·Granted Apr 5, 2016·2 cites·15 claims
- 2060US6277253B1External coating of tungsten or tantalum or other refractory metal on IMP coilsAPPLIED MATERIALS INC·Filed 1999·Granted Aug 21, 2001·21 cites·40 claims
- 2158US6171455B1Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such targetAPPLIED MATERIALS INC·Filed 1999·Granted Jan 9, 2001·15 cites·24 claims
- 2255US11749537B2Side storage pods, equipment front end modules, and methods for operating equipment front end modulesAPPLIED MATERIALS INC·Filed 2019·Granted Sep 5, 2023·0 cites·20 claims
- 2355US6126791ATarget for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such targetAPPLIED MATERIALS INC·Filed 1999·Granted Oct 3, 2000·12 cites·25 claims
- 2450US2012237693A1In-situ clean process for metal deposition chambersJACKSON MICHAEL·Filed 2012·Application pending·0 cites
- 2548US11569102B2Oxidation inhibiting gas in a manufacturing systemAPPLIED MATERIALS INC·Filed 2020·Granted Jan 31, 2023·0 cites·19 claims
- 2643US2014165911A1Apparatus for providing plasma to a process chamberAPPLIED MATERIALS INC·Filed 2012·Application pending·0 cites
- 2742US2002047116A1Coil for sputter depositionFiled 2001·Application pending·0 cites
- 2841US8764961B2Cu surface plasma treatment to improve gapfill windowLUO QIAN·Filed 2008·Granted Jul 1, 2014·0 cites·18 claims
- 2941US2002182887A1Method and apparatus of forming a sputtered doped seed layerAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3040US2002088716A1Method of enhancing hardness of sputter deposited copper filmsFiled 2002·Application pending·0 cites
- 3140US2002102365A1Adhesion of diffusion barrier and fluorinated silicon dioxide using hydrogen based preclean technologyAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3236US2011315319A1Pre-clean chamber with reduced ion currentFORSTER JOHN C·Filed 2011·Application pending·0 cites
- 3335US2002093101A1Method of metallization using a nickel-vanadium layerFiled 2001·Application pending·0 cites
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