Inventor · disambiguated record
Teiichi Inada
Also filed as: INADA TEIICHI
27 granted patents·17 pending applications·689 citations·filing 1995–2017
97Inventor score
Top patents by PatentIndex Score
44 records- 0195US7875500B2Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting supportHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 25, 2011·25 cites·16 claims
- 0295US6673441B1Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2000·Granted Jan 6, 2004·55 cites·23 claims
- 0394US8617930B2Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2012·Granted Dec 31, 2013·19 cites·13 claims
- 0493US7968195B2Dicing tape laminated with adhesive sheet of polymer, epoxy resin and fillerHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 28, 2011·18 cites·15 claims
- 0593US7968194B2Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and fillerHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 28, 2011·19 cites·15 claims
- 0689US6265782B1Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated filmHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 24, 2001·99 cites·37 claims
- 0788US6838170B2Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the sameHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jan 4, 2005·24 cites·46 claims
- 0887US8470115B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 25, 2013·8 cites·3 claims
- 0987US8465615B2Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2011·Granted Jun 18, 2013·8 cites·9 claims
- 1085US8119737B2Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Granted Feb 21, 2012·2 cites·10 claims
- 1185US7578891B2Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 25, 2009·11 cites·10 claims
- 1284US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 1383US5874009AMultilayer printed circuit board with epoxy resin and carboxylated rubber as adhesiveHITACHI CHEMICAL CO LTD·Filed 1995·Granted Feb 23, 1999·50 cites·3 claims
- 1482US6621170B2Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Sep 16, 2003·29 cites·29 claims
- 1582US5690837AProcess for producing multilayer printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1995·Granted Nov 25, 1997·55 cites·13 claims
- 1680US6184577B1Electronic component parts deviceHITACHI CHEMICAL CO LTD·Filed 1997·Granted Feb 6, 2001·62 cites·8 claims
- 1780US6090468AMultilayer wiring board for mounting semiconductor device and method of producing the sameHITACHI CHEMICAL CO LTD·Filed 1997·Granted Jul 18, 2000·63 cites·18 claims
- 1879US7947779B2Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymerHITACHI CHEMICAL CO LTD·Filed 2010·Granted May 24, 2011·3 cites·8 claims
- 1979US5935452AResin composition and its use in production of multilayer printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 10, 1999·33 cites·4 claims
- 2078US8017444B2Adhesive sheet, semiconductor device, and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Sep 13, 2011·8 cites·15 claims
- 2177US8840811B2Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the sameYASUDA YUUSUKE·Filed 2010·Granted Sep 23, 2014·8 cites·16 claims
- 2275US5965269AAdhesive, adhesive film and adhesive-backed metal foilHITACHI CHEMICAL CO LTD·Filed 1996·Granted Oct 12, 1999·40 cites·26 claims
- 2365US8003207B2Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Aug 23, 2011·2 cites·5 claims
- 2465US7772317B2Resin molding materialHITACHI CHEMICAL CO LTD·Filed 2006·Granted Aug 10, 2010·2 cites·18 claims
- 2559US11535782B2Resin member and sheet using same, and heat storage material and heat control sheet using sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Dec 27, 2022·0 cites·8 claims
- 2657US2014332984A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 2754US8012580B2Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2009·Granted Sep 6, 2011·0 cites·5 claims
- 2854US2013295314A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 2954US2013302570A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 3053US11441022B2Resin member and sheet using same, method for producing resin member, and heat storage material and heat control sheet using sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Sep 13, 2022·0 cites·11 claims
- 3153US2009186955A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2009·Application pending·0 cites
- 3252US2008171187A1Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor deviceINADA TEIICHI·Filed 2008·Application pending·0 cites
- 3350US2012135176A1Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor deviceTANAKA MAIKO·Filed 2012·Application pending·0 cites
- 3450US2012080808A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 3548US2011281399A1Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor deviceOOKUBO KEISUKE·Filed 2011·Application pending·0 cites
- 3648US2007036971A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2006·Application pending·0 cites
- 3747US2006106166A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 3847US2006100315A1Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor deviceINADA TEIICHI·Filed 2005·Application pending·0 cites
- 3946US2014293626A1Thermally conductive sheet, process for producing the same, and radiator utilizing thermally conductive sheetHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 4046US2008261039A1Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor DeviceTANAKA MAIKO·Filed 2005·Application pending·0 cites
- 4143US2011287250A1Adhesive sheet, semiconductor device, and process for producing semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
- 4241US2010073882A1Thermally conductive sheet, process for producing the same, and radiator utilizing thermally conductive sheetYOSHIKAWA TOORU·Filed 2007·Application pending·0 cites
- 4340US2006128065A1Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing methodINADA TEIICHI·Filed 2004·Application pending·0 cites
- 4435US2011237001A1Semiconductor chip used for evaluation, evaluation system, and repairing method thereofHASEBE TAKEHIKO·Filed 2011·Application pending·0 cites
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