Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Abstract

An adhesive sheet comprising a release substrate 10 , a substrate film 14 , and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14 , wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10 , and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

What is claimed is: 
     
         1 . An adhesive sheet comprising a release substrate, an adhesive layer, a tacky layer, and a substrate film, which are laminated in order,
 wherein the adhesive layer has a pre-determined first plane shape and is formed on part of the release substrate;   wherein a first incision is formed from a side bringing contact with the adhesive layer along the periphery of the plane shape on the release substrate; and   wherein the first incision has a depth of less than the thickness of the release substrate and 25 μm or less.   
     
     
         2 . The adhesive sheet of  claim 1 , wherein a value of (d1/a) satisfies the following formula (1):
   0<( d 1 /a )≦0.7  (1),
   and wherein a (μm) is a thickness of the release substrate, and d1 (μm) is a depth of the first incision.   
     
     
         3 . The adhesive sheet of  claim 1 , wherein the tacky layer covers the adhesive layer and is laminated so as to bring contact with the release substrate around the adhesive layer. 
     
     
         4 . The adhesive sheet of  claim 3 ,
 wherein the tacky layer and the substrate film have pre-determined second plane shapes and are partly formed on the release substrate;   wherein a second incision is formed from a side bringing contact with the tacky layer along the periphery of the second plane shape on the release substrate; and   wherein the second incision has a depth of less than the thickness of the release substrate and 25 μm or less.   
     
     
         5 . The adhesive sheet of  claim 4 , wherein a value of (d2/a) satisfies the following formula (2):
   0<( d 2 /a )≦0.7  (2),
   and wherein a (μm) is a thickness of the release substrate, and d2 (μm) is a depth of the second incision.   
     
     
         6 . The adhesive sheet of  claim 1 , wherein the adhesive layer has a plane shape which matches a plane shape of an adherend to which the adhesive layer is stuck after the release substrate is peeled off. 
     
     
         7 . The adhesive sheet of  claim 1 , wherein the tacky layer has tack strength to the adherend to which the tacky layer is stuck after the release substrate is peeled off the adhesive layer. 
     
     
         8 . The adhesive sheet of  claim 1 , wherein the tacky layer has tack strength to the adhesive layer, which is lowered by irradiating high energy beams.