Inventor · disambiguated record
Irmgard Escher-Poeppel
Also filed as: ESCHER-POEPPEL IRMGARD
41 granted patents·5 pending applications·187 citations·filing 2006–2023
97Inventor score
Files withINFINEON TECHNOLOGIES AG28BEER GOTTFRIED6INTEL DEUTSCHLAND GMBH3FUERGUT EDWARD2POEPPEL GERHARD JOSEF2
Top patents by PatentIndex Score
46 records- 0196US9070615B2Method for making a sensor device using a graphene layerINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 30, 2015·20 cites·25 claims
- 0296US8759153B2Method for making a sensor device using a graphene layerELIAN KLAUS·Filed 2011·Granted Jun 24, 2014·23 cites·25 claims
- 0394US9584889B2System and method for packaged MEMS device having embedding arrangement, MEMS die, and grilleINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 28, 2017·17 cites·23 claims
- 0494US9536953B2Method for making a sensor device using a graphene layerINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 3, 2017·9 cites·29 claims
- 0594US8829663B2Stackable semiconductor package with encapsulant and electrically conductive feed-throughPOHL JENS·Filed 2007·Granted Sep 9, 2014·36 cites·21 claims
- 0694US8216881B2Method for fabricating a semiconductor and semiconductor packageBEER GOTTFRIED·Filed 2010·Granted Jul 10, 2012·12 cites·9 claims
- 0791US8258624B2Method for fabricating a semiconductor and semiconductor packageBEER GOTTFRIED·Filed 2007·Granted Sep 4, 2012·13 cites·7 claims
- 0885US8492200B2Method for fabricating a semiconductor and semiconductor packageBEER GOTTFRIED·Filed 2012·Granted Jul 23, 2013·4 cites·19 claims
- 0983US9768037B2Electronic device package including metal blocksINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 19, 2017·6 cites·7 claims
- 1081US10643971B2Method for fabricating a semiconductor and semiconductor packageINTEL DEUTSCHLAND GMBH·Filed 2019·Granted May 5, 2020·1 cites·20 claims
- 1176US7666777B2Electronic structure with components connected by way of solderable connecting elements and methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·7 cites·9 claims
- 1275US12261146B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Mar 25, 2025·0 cites·12 claims
- 1375US8169070B2Semiconductor devicePOEPPEL GERHARD JOSEF·Filed 2009·Granted May 1, 2012·7 cites·18 claims
- 1474US10957671B2Method for fabricating a semiconductor and semiconductor packageINTEL DEUTSCHLAND GMBH·Filed 2020·Granted Mar 23, 2021·0 cites·16 claims
- 1574US8071428B2Semiconductor devicePOHL JENS·Filed 2009·Granted Dec 6, 2011·5 cites·18 claims
- 1674US8035224B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Granted Oct 11, 2011·6 cites·9 claims
- 1773US10014275B2Method for producing a chip assemblageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 3, 2018·2 cites·19 claims
- 1873US7408241B2Semiconductor device with a recessed bond padINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 5, 2008·5 cites·19 claims
- 1971US9275916B2Removable indicator structure in electronic chips of a common substrate for process adjustmentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·2 cites·14 claims
- 2070US7915089B2Encapsulation methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 29, 2011·4 cites·22 claims
- 2169US10886186B2Semiconductor package systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 5, 2021·1 cites·24 claims
- 2269US10573533B2Method of reducing a sheet resistance in an electronic device, and an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 25, 2020·1 cites·13 claims
- 2366US9129959B2Method for manufacturing an electronic module and an electronic moduleFUERGUT EDWARD·Filed 2012·Granted Sep 8, 2015·2 cites·26 claims
- 2464US11715719B2Semiconductor package and method of forming a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 1, 2023·0 cites·23 claims
- 2561US9230894B2Methods for manufacturing a chip packageFUERGUT EDWARD·Filed 2012·Granted Jan 5, 2016·1 cites·27 claims
- 2660US10438926B2Method for fabricating a semiconductor and semiconductor packageINTEL DEUTSCHLAND GMBH·Filed 2014·Granted Oct 8, 2019·0 cites·10 claims
- 2760US9355984B2Electronic device and method for fabricating an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 31, 2016·1 cites·5 claims
- 2859US11531056B2Predictive chip-maintenanceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 20, 2022·0 cites·28 claims
- 2959US8728869B2Method for fabricating a semiconductor device and semiconductor packageINTEL MOBILE COMM GMBH·Filed 2013·Granted May 20, 2014·0 cites·12 claims
- 3058US11688713B2Additive manufacturing of a frontside or backside interconnect of a semiconductor dieINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Jun 27, 2023·0 cites·13 claims
- 3158US7893532B2External contact material for external contacts of a semiconductor device and method of making the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 22, 2011·1 cites·13 claims
- 3258US7585701B2Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive filmINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 8, 2009·1 cites·8 claims
- 3357US8658468B2Method for fabricating a semiconductor and semiconductor packageBEER GOTTFRIED·Filed 2012·Granted Feb 25, 2014·0 cites·6 claims
- 3454US11393742B2Method for fabricating a semiconductor flip-chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 3551US2010025848A1Method of fabricating a semiconductor device and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2008·Application pending·0 cites
- 3649US8119452B2Method of fabricating a semiconductor deviceBEER GOTTFRIED·Filed 2009·Granted Feb 21, 2012·0 cites·19 claims
- 3748US9287206B2Method of fabricating a semiconductor device with encapsulantBEER GOTTFRIED·Filed 2011·Granted Mar 15, 2016·0 cites·24 claims
- 3847US8394673B2Semiconductor devicePOEPPEL GERHARD JOSEF·Filed 2012·Granted Mar 12, 2013·0 cites·18 claims
- 3946US9818730B2Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 14, 2017·0 cites·28 claims
- 4046US9620459B2Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 11, 2017·0 cites·21 claims
- 4145US10096584B2Method for producing a power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 9, 2018·0 cites·29 claims
- 4244US10734352B2Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 4, 2020·0 cites·21 claims
- 4343US2023178428A1Leaded semiconductor package formation using lead frame with structured central padINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 4443US2016336226A1Method of reducing a sheet resistance in an electronic device, and an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 4543US2020227312A1Semiconductor devices including adhesion promoting structures and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 4642US2020006187A1Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →