Inventor · disambiguated record
Brian E. Goodlin
Also filed as: GOODLIN BRIAN · GOODLIN BRIAN E
35 granted patents·9 pending applications·168 citations·filing 2004–2024
97Inventor score
Top patents by PatentIndex Score
44 records- 0195US10009001B2Devices with specific termination angles in titanium tungsten layers and methods for fabricating the sameTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 26, 2018·22 cites·20 claims
- 0295US9896330B2Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 20, 2018·12 cites·20 claims
- 0393US7833895B2TSVS having chemically exposed TSV tips for integrated circuit devicesTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 16, 2010·24 cites·8 claims
- 0491US9503047B2Bulk acoustic wave (BAW) device having roughened bottom sideTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 22, 2016·8 cites·3 claims
- 0589US9583336B1Process to enable ferroelectric layers on large area substratesTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 28, 2017·8 cites·19 claims
- 0689US9524881B2Method for fabricating specific termination angles in titanium tungsten layersTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 20, 2016·6 cites·23 claims
- 0789US8043973B2Mask overhang reduction or elimination after substrate etchTEXAS INSTRUMENTS INC·Filed 2009·Granted Oct 25, 2011·14 cites·7 claims
- 0888US10233074B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 19, 2019·4 cites·17 claims
- 0985US8551248B2Showerhead for CVD depositionsGOODLIN BRIAN E·Filed 2011·Granted Oct 8, 2013·8 cites·8 claims
- 1084US8551890B2Showerhead for CVD depositionsGOODLIN BRIAN E·Filed 2012·Granted Oct 8, 2013·7 cites·9 claims
- 1182US11498831B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 15, 2022·1 cites·7 claims
- 1282US10723616B2Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chipTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 28, 2020·2 cites·19 claims
- 1382US7229869B2Method for manufacturing a semiconductor device using a sidewall spacer etchbackTEXAS INSTRUMENTS INC·Filed 2005·Granted Jun 12, 2007·11 cites·30 claims
- 1480US8617960B2Silicon microphone transducerDENISON MARIE·Filed 2010·Granted Dec 31, 2013·6 cites·15 claims
- 1579US11146230B2Method for creating double bragg mirror for tight frequency reference controlTEXAS INSTRUMENTS INC·Filed 2019·Granted Oct 12, 2021·2 cites·20 claims
- 1677US11075157B2IC having trench-based metal-insulator-metal capacitorTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 27, 2021·2 cites·22 claims
- 1777US9607847B1Enhanced lateral cavity etchTEXAS INSTRUMENTS INC·Filed 2015·Granted Mar 28, 2017·2 cites·9 claims
- 1876US10840179B2Electronic devices with bond pads formed on a molybdenum layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 17, 2020·2 cites·27 claims
- 1973US7612454B2Semiconductor device with improved contact fuseTEXAS INSTRUMENTS INC·Filed 2008·Granted Nov 3, 2009·5 cites·20 claims
- 2072US8962350B2Multi-step deposition of ferroelectric dielectric materialTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 24, 2015·2 cites·16 claims
- 2171US2024413242A1Laser anneal formed nanosheet ldmos transistorTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2270US7018888B2Method for manufacturing improved sidewall structures for use in semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 28, 2006·16 cites·18 claims
- 2365US7413980B2Semiconductor device with improved contact fuseTEXAS INSTRUMENTS INC·Filed 2006·Granted Aug 19, 2008·3 cites·8 claims
- 2464US11616011B2IC having trench-based metal-insulator-metal capacitorTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 28, 2023·0 cites·25 claims
- 2562US10570006B2Infrared sensor design using an epoxy film as an infrared absorption layerTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 25, 2020·0 cites·16 claims
- 2660US8026177B2Silicon dioxide cantilever support and method for silicon etched structuresTEXAS INSTRUMENTS INC·Filed 2009·Granted Sep 27, 2011·1 cites·5 claims
- 2759US2025336744A1Semiconductor devices with oxidized layer segments in device regionsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2856US12424443B2Fin field-effect transistor semiconductor device and method of forming the sameTEXAS INSTRUMENTS INC·Filed 2021·Granted Sep 23, 2025·0 cites·17 claims
- 2955US11394361B2Buk acoustic wave resonator with guard rings having recessed space from electrode edge and periodic designsTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 3054US10680056B1IC with ion milled thin-film resistorsTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 3154US10009008B2Bulk acoustic wave (BAW) device having roughened bottom sideTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 26, 2018·0 cites·36 claims
- 3253US2015246810A1Infrared sensor design using an epoxy film as an infrared absorption layerTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
- 3352US2024105450A1Group iii-v semiconductor device and method of fabrication of same including in-situ surface passivationTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3451US10651817B2Bulk acoustic wave resonator on a stress isolated platformTEXAS INSTRUMENTS INC·Filed 2017·Granted May 12, 2020·0 cites·24 claims
- 3551US10526198B2Infrared sensor design using an epoxy film as an infrared absorption layerJACKSON RICKY ALAN·Filed 2012·Granted Jan 7, 2020·0 cites·12 claims
- 3651US8114779B2Silicon dioxide cantilever support and method for silicon etched structuresMEINEL WALTER B·Filed 2011·Granted Feb 14, 2012·0 cites·12 claims
- 3751US8115272B2Silicon dioxide cantilever support and method for silicon etched structuresMEINEL WALTER B·Filed 2011·Granted Feb 14, 2012·0 cites·27 claims
- 3851US2013240637A1Showerhead for cvd depositionsTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 3948US2017178916A1Enhanced lateral cavity etchTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 4046US9305998B2Adhesion of ferroelectric material to underlying conductive capacitor plateTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 5, 2016·0 cites·13 claims
- 4146US2011018107A1TSVS Having Chemically Exposed TSV Tips for Integrated Circuit DevicesTEXAS INSTRUMENTS INC·Filed 2010·Application pending·0 cites
- 4245US9157807B2Etching cavity structures in silicon under dielectric membraneMEINEL WALTER B·Filed 2009·Granted Oct 13, 2015·0 cites·11 claims
- 4341US2013249096A1Through silicon via fillingEISSA MONA·Filed 2012·Application pending·0 cites
- 4437US2018358258A1Single mask level forming both top-side-contact and isolation trenchesTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
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