Inventor · disambiguated record
Chien-Teh Kao
Also filed as: KAO CHIEN-TEH
51 granted patents·22 pending applications·4,782 citations·filing 1997–2025
99Inventor score
Top patents by PatentIndex Score
73 records- 0199US10400335B2Dual-direction chemical delivery system for ALD/CVD chambersAPPLIED MATERIALS INC·Filed 2017·Granted Sep 3, 2019·363 cites·12 claims
- 0299US9765432B2Dual-direction chemical delivery system for ALD/CVD chambersAPPLIED MATERIALS INC·Filed 2016·Granted Sep 19, 2017·362 cites·15 claims
- 0399US9353440B2Dual-direction chemical delivery system for ALD/CVD chambersAPPLIED MATERIALS INC·Filed 2013·Granted May 31, 2016·373 cites·18 claims
- 0498USRE47440EApparatus and method for providing uniform flow of gasAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·360 cites·31 claims
- 0598US7939422B2Methods of thin film processAPPLIED MATERIALS INC·Filed 2007·Granted May 10, 2011·240 cites·25 claims
- 0698US7520957B2Lid assembly for front end of line fabricationAPPLIED MATERIALS INC·Filed 2005·Granted Apr 21, 2009·162 cites·8 claims
- 0798US7494545B2Epitaxial deposition process and apparatusAPPLIED MATERIALS INC·Filed 2006·Granted Feb 24, 2009·246 cites·10 claims
- 0898US7396480B2Method for front end of line fabricationAPPLIED MATERIALS INC·Filed 2005·Granted Jul 8, 2008·285 cites·20 claims
- 0998US6603269B1Resonant chamber applicator for remote plasma sourceAPPLIED MATERIALS INC·Filed 2000·Granted Aug 5, 2003·252 cites·7 claims
- 1098US6461435B1Showerhead with reduced contact areaAPPLIED MATERIALS INC·Filed 2000·Granted Oct 8, 2002·600 cites·22 claims
- 1198US6271148B1Method for improved remote microwave plasma source for use with substrate processing systemAPPLIED MATERIALS INC·Filed 1999·Granted Aug 7, 2001·647 cites·26 claims
- 1297US8846163B2Method for removing oxidesKAO CHIEN-TEH·Filed 2012·Granted Sep 30, 2014·190 cites·19 claims
- 1397US7871926B2Methods and systems for forming at least one dielectric layerAPPLIED MATERIALS INC·Filed 2007·Granted Jan 18, 2011·77 cites·17 claims
- 1496US7604708B2Cleaning of native oxide with hydrogen-containing radicalsAPPLIED MATERIALS INC·Filed 2004·Granted Oct 20, 2009·226 cites·16 claims
- 1595US7767024B2Method for front end of line fabricationAPPPLIED MATERIALS INC·Filed 2008·Granted Aug 3, 2010·28 cites·28 claims
- 1694US12362149B2Film stress control for plasma enhanced chemical vapor depositionAPPLIED MATERIALS INC·Filed 2023·Granted Jul 15, 2025·1 cites·20 claims
- 1794US9551070B2In-situ corrosion resistant substrate support coatingAPPLIED MATERIALS INC·Filed 2014·Granted Jan 24, 2017·20 cites·8 claims
- 1891US7780793B2Passivation layer formation by plasma clean process to reduce native oxide growthAPPLIED MATERIALS INC·Filed 2007·Granted Aug 24, 2010·19 cites·24 claims
- 1990US6125859AMethod for improved cleaning of substrate processing systemsAPPLIED MATERIALS INC·Filed 1997·Granted Oct 3, 2000·131 cites·25 claims
- 2089US10697062B2Gas flow guide design for uniform flow distribution and efficient purgeAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·3 cites·19 claims
- 2189US10593539B2Support assemblyKAO CHIEN TEH·Filed 2012·Granted Mar 17, 2020·5 cites·20 claims
- 2288US9004006B2Process chamber lid design with built-in plasma source for short lifetime speciesKAO CHIEN-TEH·Filed 2011·Granted Apr 14, 2015·5 cites·18 claims
- 2388US7550381B2Contact clean by remote plasma and repair of silicide surfaceAPPLIED MATERIALS INC·Filed 2005·Granted Jun 23, 2009·12 cites·14 claims
- 2487US11854771B2Film stress control for plasma enhanced chemical vapor depositionAPPLIED MATERIALS INC·Filed 2021·Granted Dec 26, 2023·1 cites·15 claims
- 2587US11094508B2Film stress control for plasma enhanced chemical vapor depositionAPPLIED MATERIALS INC·Filed 2018·Granted Aug 17, 2021·3 cites·20 claims
- 2687US6645884B1Method of forming a silicon nitride layer on a substrateAPPLIED MATERIALS INC·Filed 1999·Granted Nov 11, 2003·61 cites·26 claims
- 2786US9982343B2Apparatus for providing plasma to a process chamberAPPLIED MATERIALS INC·Filed 2012·Granted May 29, 2018·3 cites·19 claims
- 2884US8268684B2Method and apparatus for trench and via profile modificationCHANG MEI·Filed 2011·Granted Sep 18, 2012·5 cites·20 claims
- 2984US7994002B2Method and apparatus for trench and via profile modificationAPPLIED MATERIALS INC·Filed 2009·Granted Aug 9, 2011·7 cites·21 claims
- 3084US7867789B2Contact clean by remote plasma and repair of silicide surfaceAPPLIED MATERIALS INC·Filed 2009·Granted Jan 11, 2011·7 cites·20 claims
- 3183US7955510B2Oxide etch with NH4-NF3 chemistryAPPLIED MATERIALS INC·Filed 2009·Granted Jun 7, 2011·6 cites·20 claims
- 3281US10312475B2CVD thin film stress control method for display applicationAPPLIED MATERIALS INC·Filed 2017·Granted Jun 4, 2019·3 cites·19 claims
- 3381US6026762AApparatus for improved remote microwave plasma source for use with substrate processing systemsAPPLIED MATERIALS INC·Filed 1997·Granted Feb 22, 2000·54 cites·28 claims
- 3479US9109754B2Apparatus and method for providing uniform flow of gasAPPLIED MATERIALS INC·Filed 2012·Granted Aug 18, 2015·4 cites·26 claims
- 3578US2021225640A1Support assemblyAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 3675US8252696B2Selective etching of silicon nitrideLU XINLIANG·Filed 2008·Granted Aug 28, 2012·5 cites·16 claims
- 3774US9881787B2Deposition methods for uniform and conformal hybrid titanium oxide filmsAPPLIED MATERIALS INC·Filed 2016·Granted Jan 30, 2018·2 cites·12 claims
- 3872US12394595B2Multi-antenna unit for large area inductively coupled plasma processing apparatusAPPLIED MATERIALS INC·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 3971US2020006054A1Support assemblyAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4067US6933021B2Method of TiSiN deposition using a chemical vapor deposition (CVD) processAPPLIED MATERIALS INC·Filed 2002·Granted Aug 23, 2005·11 cites·40 claims
- 4167US2025372347A1Low profile and embedded gas diffusers in an inductively coupled plasma chamber employing antenna arraysAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 4266USRE48994EApparatus and method for providing uniform flow of gasAPPLIED MATERIALS INC·Filed 2019·Granted Mar 29, 2022·0 cites·33 claims
- 4365US9627185B2Methods and apparatus for in-situ cleaning of a process chamberAPPLIED MATERIALS INC·Filed 2014·Granted Apr 18, 2017·1 cites·15 claims
- 4464US11664216B2ALD process and hardware with improved purge efficiencyAPPLIED MATERIALS INC·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 4563US8318605B2Plasma treatment method for preventing defects in doped silicon oxide surfaces during exposure to atmosphereKAO CHIEN-TEH·Filed 2008·Granted Nov 27, 2012·1 cites·20 claims
- 4663US8043933B2Integration sequences with top surface profile modificationAPPLIED MATERIALS INC·Filed 2009·Granted Oct 25, 2011·1 cites·20 claims
- 4761US2014076234A1Multi chamber processing systemAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4861US2009111280A1Method for removing oxidesAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4959US7910853B2Direct real-time monitoring and feedback control of RF plasma output for wafer processingAPPLIED MATERIALS INC·Filed 2008·Granted Mar 22, 2011·0 cites·12 claims
- 5056US10964533B2ALD process and hardware with improved purge efficiencyAPPLIED MATERIALS INC·Filed 2018·Granted Mar 30, 2021·0 cites·20 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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