Inventor · disambiguated record
Kazuaki Ano
Also filed as: ANO KAZUAKI
13 granted patents·12 pending applications·265 citations·filing 1997–2011
92Inventor score
Top patents by PatentIndex Score
25 records- 0191US6815836B2Wire bonding for thin semiconductor packageTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 9, 2004·65 cites·7 claims
- 0284US6087717ASemiconductor device and manufacturing methodTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 11, 2000·82 cites·20 claims
- 0383US7233074B2Semiconductor device with improved contactsTEXAS INSTRUMENTS INC·Filed 2005·Granted Jun 19, 2007·9 cites·2 claims
- 0477US7192861B2Wire bonding for thin semiconductor packageTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 20, 2007·22 cites·5 claims
- 0577US6060775ASemiconductor deviceTEXAS INSTRUMENTS INC·Filed 1997·Granted May 9, 2000·42 cites·8 claims
- 0675US7154166B2Low profile ball-grid array package for high powerTEXAS INSTRUMENTS INC·Filed 2001·Granted Dec 26, 2006·15 cites·20 claims
- 0768US8310069B2Semiconductor package having marking layerANO KAZUAKI·Filed 2008·Granted Nov 13, 2012·7 cites·11 claims
- 0865US8058706B2Delamination resistant packaged die having support and shaped die having protruding lip on supportFENG CHIEN-TE·Filed 2009·Granted Nov 15, 2011·5 cites·17 claims
- 0965US7893544B2Semiconductor device having improved contactsTEXAS INSTRUMENTS INC·Filed 2007·Granted Feb 22, 2011·2 cites·16 claims
- 1059US6969638B2Low cost substrate for an integrated circuit device with bondpads free of plated goldTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 29, 2005·14 cites·17 claims
- 1153US2008179761A1Semiconductor package having evaporated symbolizationTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1247US7829389B2Roll-on encapsulation method for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2008·Granted Nov 9, 2010·0 cites·4 claims
- 1347US7350293B2Low profile ball-grid array package for high powerTEXAS INSTRUMENTS INC·Filed 2006·Granted Apr 1, 2008·0 cites·6 claims
- 1447US2011136335A1Semiconductor Device with Improved ContactsTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 1545US6977443B2Substrate for carrying a semiconductor chip and semiconductor device using sameTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 20, 2005·2 cites·5 claims
- 1643US2009108433A1Multilayer semiconductor device package assembly and methodMASUMOTO KENJI·Filed 2007·Application pending·0 cites
- 1741US2003203063A1Air release molding systemFiled 2002·Application pending·0 cites
- 1840US2009236715A1Semiconductor package structure with laminated interposing layerANO KAZUAKI·Filed 2008·Application pending·0 cites
- 1939US2005139643A1Method and system for applying solderTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 2037US2011001227A1Semiconductor Chip Secured to Leadframe by FrictionTEXAS INSTRUMENTS INC·Filed 2010·Application pending·0 cites
- 2137US2008230880A1Leadframe Array with Riveted Heat SinksANO KAZUAKI·Filed 2008·Application pending·0 cites
- 2236US2004262370A1High reliability solder joint with multilayer structureFiled 2003·Application pending·0 cites
- 2335US2003132520A1Semiconductor device and mounting methodFiled 2003·Application pending·0 cites
- 2434US2003111716A1Wirebonded multichip moduleFiled 2001·Application pending·0 cites
- 2534US2006024974A1Surface treatment for oxidation removal in integrated circuit package assembliesTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →