Assignee
MASUMOTO KENJI
JP·1 granted patent·3 pending applications·38 citations·filing 2007–2009
Top patents by PatentIndex Score
4 records- 0192US8115310B2Copper pillar bonding for fine pitch flip chip devicesMASUMOTO KENJI·Filed 2009·Granted Feb 14, 2012·38 cites·18 claims
- 0244US2011024899A1Substrate structure for cavity packageMASUMOTO KENJI·Filed 2009·Application pending·0 cites
- 0344US2010289138A1Substrate structure for flip-chip interconnect deviceMASUMOTO KENJI·Filed 2009·Application pending·0 cites
- 0443US2009108433A1Multilayer semiconductor device package assembly and methodMASUMOTO KENJI·Filed 2007·Application pending·0 cites
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