Inventor · disambiguated record
Keiichiro Asakawa
Also filed as: ASAKAWA KEIICHIRO
8 granted patents·3 pending applications·243 citations·filing 1998–2016
89Inventor score
Top patents by PatentIndex Score
11 records- 0188US6237585B1Wire-sawing machineSUPER SILICON CRYSTAL RES INST·Filed 2000·Granted May 29, 2001·40 cites·4 claims
- 0282US6422067B1Slurry useful for wire-saw slicing and evaluation of slurrySUPER SILICON CRYSTAL RES INST·Filed 2000·Granted Jul 23, 2002·23 cites·1 claims
- 0382US6004405AWafer having a laser mark on chamfered edgeSUPER SILICON CRYSTAL RES INST·Filed 1998·Granted Dec 21, 1999·69 cites·4 claims
- 0477US6178961B1Wire saw control method and wire sawTOKYO SEIMITSU CO LTD·Filed 2000·Granted Jan 30, 2001·26 cites·9 claims
- 0574US6065461AIngot slicing method and apparatus thereforSUPER SILICON CRYSTAL RES INST·Filed 1998·Granted May 23, 2000·35 cites·3 claims
- 0665US5993292AProduction of notchless waferSUPER SILICON CRYSTAL RES INST·Filed 1998·Granted Nov 30, 1999·31 cites·2 claims
- 0763US6261166B1Wire cleaning apparatusSUPER SILICON CRYSTAL RES INST·Filed 2000·Granted Jul 17, 2001·12 cites·2 claims
- 0855US6234160B1Abnormality transmission system for wire sawTOKYO SEIMITSU CO LTD·Filed 2000·Granted May 22, 2001·7 cites·4 claims
- 0938US2007023395A1Production method for semiconductor waferSUMCO CORP·Filed 2004·Application pending·0 cites
- 1037US2003100455A1Aqueous grinding fluid for wire-sawing or band-sawingFiled 2000·Application pending·0 cites
- 1127US2017004995A1Film Forming Apparatus and Film Forming MethodULVAC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →