Inventor · disambiguated record
Gwi-Gyeon Yang
Also filed as: YANG GWI-GYEON
5 granted patents·2 pending applications·235 citations·filing 2002–2014
84Inventor score
Top patents by PatentIndex Score
7 records- 0196US7061080B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Jun 13, 2006·127 cites·15 claims
- 0292US7208819B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Apr 24, 2007·69 cites·11 claims
- 0388US8198139B2Power device package and method of fabricating the sameYANG GWI-GYEON·Filed 2008·Granted Jun 12, 2012·25 cites·21 claims
- 0475US7846779B2Power device package and method of fabricating the sameFairchild Korea·Filed 2008·Granted Dec 7, 2010·10 cites·25 claims
- 0570US8796831B2Complex semiconductor packages and methods of fabricating the sameYANG GWI-GYEON·Filed 2009·Granted Aug 5, 2014·4 cites·22 claims
- 0652US2014327144A1Complex Semiconductor Packages and Methods of Fabricating the SameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2014·Application pending·0 cites
- 0751US2013207253A1Complex Semiconductor Packages and Methods of Fabricating the SameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →