Inventor · disambiguated record
Claes Bjorkman
Also filed as: BJOERKMAN CLAES · BJOERKMAN CLAES H · BJORKMAN CLAES · BJORKMAN CLAES H
40 granted patents·8 pending applications·3,551 citations·filing 1974–2016
99Inventor score
Files withAPPLIED MATERIALS INC30NYBO SEAL SYSTEM AB3NYBOHOV DEV AB3APPLIED MATRIALS INC1LUNDBLAD LEIF1
Top patents by PatentIndex Score
48 records- 0199US7110629B2Optical ready substratesAPPLIED MATERIALS INC·Filed 2003·Granted Sep 19, 2006·314 cites·21 claims
- 0299US7043106B2Optical ready wafersAPPLIED MATERIALS INC·Filed 2002·Granted May 9, 2006·297 cites·31 claims
- 0398US6340435B1Integrated low K dielectrics and etch stopsAPPLIED MATERIALS INC·Filed 1999·Granted Jan 22, 2002·536 cites·14 claims
- 0498US6074514AHigh selectivity etch using an external plasma dischargeAPPLIED MATERIALS INC·Filed 1998·Granted Jun 13, 2000·504 cites·22 claims
- 0597US6858153B2Integrated low K dielectrics and etch stopsAPPLIED MATERIALS INC·Filed 2001·Granted Feb 22, 2005·256 cites·21 claims
- 0697US6403491B1Etch method using a dielectric etch chamber with expanded process windowAPPLIED MATERIALS INC·Filed 2000·Granted Jun 11, 2002·396 cites·24 claims
- 0796US6716302B2Dielectric etch chamber with expanded process windowAPPLIED MATERIALS INC·Filed 2002·Granted Apr 6, 2004·91 cites·18 claims
- 0896US6568346B2Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supplyAPPLIED MATERIALS INC·Filed 2001·Granted May 27, 2003·66 cites·22 claims
- 0996US6232236B1Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1999·Granted May 15, 2001·134 cites·32 claims
- 1095US6825618B2Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supplyFiled 2003·Granted Nov 30, 2004·60 cites·4 claims
- 1195US6273022B1Distributed inductively-coupled plasma sourceAPPLIED MATERIALS INC·Filed 1998·Granted Aug 14, 2001·96 cites·42 claims
- 1294US6797639B2Dielectric etch chamber with expanded process windowAPPLIED MATERIALS INC·Filed 2002·Granted Sep 28, 2004·63 cites·30 claims
- 1393US6949203B2System level in-situ integrated dielectric etch process particularly useful for copper dual damasceneAPPLIED MATERIALS INC·Filed 2003·Granted Sep 27, 2005·69 cites·46 claims
- 1493US6669858B2Integrated low k dielectrics and etch stopsAPPLIED MATERIALS INC·Filed 2001·Granted Dec 30, 2003·47 cites·14 claims
- 1592US6902947B2Integrated method for release and passivation of MEMS structuresAPPLIED MATERIALS INC·Filed 2003·Granted Jun 7, 2005·89 cites·10 claims
- 1692US6113731AMagnetically-enhanced plasma chamber with non-uniform magnetic fieldAPPLIED MATERIALS INC·Filed 1997·Granted Sep 5, 2000·152 cites·42 claims
- 1790US6387288B1High selectivity etch using an external plasma dischargeAPPLIED MATERIALS INC·Filed 2000·Granted May 14, 2002·31 cites·8 claims
- 1890US6362109B1Oxide/nitride etching having high selectivity to photoresistAPPLIED MATERIALS INC·Filed 2000·Granted Mar 26, 2002·73 cites·23 claims
- 1989US7227244B2Integrated low k dielectrics and etch stopsAPPLIED MATERIALS INC·Filed 2004·Granted Jun 5, 2007·27 cites·8 claims
- 2088US10109138B2Stacking and dispensing moduleNCR CORP·Filed 2016·Granted Oct 23, 2018·7 cites·20 claims
- 2188US6500357B1System level in-situ integrated dielectric etch process particularly useful for copper dual damasceneAPPLIED MATERIALS INC·Filed 2000·Granted Dec 31, 2002·38 cites·14 claims
- 2280US7407081B2Methods and apparatus for transferring conductive pieces during semiconductor device fabricationAPPLIED MATERIALS INC·Filed 2005·Granted Aug 5, 2008·8 cites·13 claims
- 2377US7985689B2Patterning 3D features in a substrateAPPLIED MATRIALS INC·Filed 2007·Granted Jul 26, 2011·6 cites·23 claims
- 2476US6686293B2Method of etching a trench in a silicon-containing dielectric materialAPPLIED MATERIALS INC·Filed 2002·Granted Feb 3, 2004·18 cites·46 claims
- 2572US7458335B1Uniform magnetically enhanced reactive ion etching using nested electromagnetic coilsAPPLIED MATERIALS INC·Filed 2002·Granted Dec 2, 2008·9 cites·24 claims
- 2670US6598726B1Machine for receiving and enclosing bank notes, where information is printed on the inside of a transparent filmNYBOHOV DEV AB·Filed 1999·Granted Jul 29, 2003·18 cites·4 claims
- 2767US5420922ASystem for the safe transmission of messagesNYBO SEAL SYSTEM AB·Filed 1994·Granted May 30, 1995·29 cites·9 claims
- 2864US6787475B2Flash step preparatory to dielectric etchFiled 2002·Granted Sep 7, 2004·12 cites·34 claims
- 2962US7105442B2Ashable layers for reducing critical dimensions of integrated circuit featuresAPPLIED MATERIALS INC·Filed 2002·Granted Sep 12, 2006·9 cites·8 claims
- 3062US7072534B2Optical ready substratesAPPLIED MATERIALS INC·Filed 2002·Granted Jul 4, 2006·7 cites·11 claims
- 3160US8580615B2Method and system for wafer level singulationSCHUEGRAF KLAUS·Filed 2012·Granted Nov 12, 2013·1 cites·9 claims
- 3260US6568154B1Method and apparatus for enclosing banknotes where information is printed on the inside of a transparent filmNYBOHOV DEV AB·Filed 1999·Granted May 27, 2003·13 cites·8 claims
- 3358US6793835B2System level in-situ integrated dielectric etch process particularly useful for copper dual damasceneFiled 2002·Granted Sep 21, 2004·5 cites·12 claims
- 3457US8942461B2Method for a banknote detector device, and a banknote detector deviceLUNDBLAD LEIF J I·Filed 2010·Granted Jan 27, 2015·1 cites·12 claims
- 3555US2006283553A1Plasma chamber insert ringAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3654US9502294B2Method and system for wafer level singulationAPPLIED MATERIALS INC·Filed 2013·Granted Nov 22, 2016·0 cites·10 claims
- 3754US5031379AMessage receiving arrangementLUNDBLAD LEIF·Filed 1990·Granted Jul 16, 1991·16 cites·2 claims
- 3850US2008283387A1Methods and apparatus for transferring conductive pieces during semiconductor device fabricationAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3949US6553922B1Safe for valuable documentsNYBOHOV DEV AB·Filed 1999·Granted Apr 29, 2003·18 cites·11 claims
- 4047US2007080414A1Optical ready substratesAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4146US5199247AArrangement for enveloping objects in enveloping material taken from two storage reelsNYBO SEAL SYSTEM AB·Filed 1992·Granted Apr 6, 1993·12 cites·14 claims
- 4246US2003106646A1Plasma chamber insert ringAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 4344US5246527AFoil-welding arrangementNYBO SEAL SYSTEM AB·Filed 1992·Granted Sep 21, 1993·12 cites·6 claims
- 4444US2005003675A1Dielectric etch chamber with expanded process windowFiled 2004·Application pending·0 cites
- 4543US3938539AApparatus for leading off air in connection with the measuring of the flow of a liquidSTROUTH LENNART·Filed 1974·Granted Feb 17, 1976·11 cites·6 claims
- 4640US2005072979A1Optical-ready wafersAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4740US2001009139A1Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing systemFiled 2001·Application pending·0 cites
- 4832US2004010999A1Device for handling sheet-like materialFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →