Methods and apparatus for transferring conductive pieces during semiconductor device fabrication

Abstract

In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.

1 . A method of transferring conductive pieces to target locations of a target substrate comprising:
 holding conductive pieces with electrodes of a transfer substrate;   aligning the held conductive pieces with the target locations of the target substrate; and   transferring the conductive pieces from the transfer substrate to the target locations of the target substrate.   
     
     
         2 . The method of  claim 1  further comprising:
 determining a target location pattern of the target substrate; and   selecting electrodes of the transfer substrate to address based on the target location pattern of the target substrate.   
     
     
         3 . The method of  claim 1  wherein transferring the conductive pieces from the transfer substrate to the target locations of the target substrate comprises transferring the conductive pieces from the transfer substrate to electrode pads of the target substrate. 
     
     
         4 . The method of  claim 1  wherein holding conductive pieces with electrodes of a transfer substrate comprises holding solder balls. 
     
     
         5 . The method of  claim 1  wherein the target substrate comprises a silicon substrate. 
     
     
         6 . The method of  claim 5  wherein the transfer substrate comprises a silicon substrate. 
     
     
         7 . A method of transferring conductive pieces to electrode pads of a target substrate comprising:
 determining an electrode pad pattern of the target substrate;   selecting electrodes of a transfer substrate to address based on the electrode pad pattern of the target substrate;   holding conductive pieces with the selected electrodes of the transfer substrate;   aligning the held conductive pieces with the electrode pads of the target substrate; and   transferring the conductive pieces from the transfer substrate to the electrode pads of the target substrate.