Inventor · disambiguated record
Jeng-Da Wu
Also filed as: WU JENG-DA
28 granted patents·25 pending applications·194 citations·filing 2003–2015
96Inventor score
Files withHON HAI PREC IND CO LTD18HONGFUJIN PREC IND SHENZHEN15ADVANCED SEMICONDUCTOR ENG10ADVANCE SEMICONDUCTOR ENGINEER2LIN YU-HSU2
Top patents by PatentIndex Score
53 records- 0192US7760498B2Electronic apparatus with air guiding elementHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Jul 20, 2010·26 cites·16 claims
- 0292US7199479B2Chip package structure and process for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Apr 3, 2007·22 cites·10 claims
- 0388US7835149B2Computer enclosure with airflow guideHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Nov 16, 2010·19 cites·13 claims
- 0485US7675753B2Mounting apparatus for heat sinkHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Mar 9, 2010·13 cites·17 claims
- 0584US7407833B2Process for fabricating chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 5, 2008·11 cites·11 claims
- 0681US6864168B2Bump and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 8, 2005·25 cites·9 claims
- 0780US7929304B2Heat dissipation apparatusHONGFUJIN PREC IND SHENZHEN·Filed 2009·Granted Apr 19, 2011·9 cites·12 claims
- 0880US6819002B2Under-ball-metallurgy layerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 16, 2004·28 cites·19 claims
- 0979US7663063B2Circuit board with improved ground planeHON HAI PREC IND CO LTD·Filed 2007·Granted Feb 16, 2010·8 cites·7 claims
- 1078US7447039B2Motherboard configured to minimize or prevent damage to a chip thereonHON HAI PREC IND CO LTD·Filed 2006·Granted Nov 4, 2008·4 cites·7 claims
- 1171US7482204B2Chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 27, 2009·4 cites·8 claims
- 1268US7633169B2Chip package structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Dec 15, 2009·3 cites·10 claims
- 1368US7606119B2Objective lens actuatorHON HAI PREC IND CO LTD·Filed 2006·Granted Oct 20, 2009·1 cites·16 claims
- 1466US8256111B2Circuit board layout methodLIN YU-HSU·Filed 2009·Granted Sep 4, 2012·3 cites·8 claims
- 1565US7864536B2Circuit board assemblyHONGFUJIN PREC IND SHENZHEN·Filed 2009·Granted Jan 4, 2011·2 cites·13 claims
- 1664US7996169B2Method and apparatus for compensating S-parameters of passive circuitsHON HAI PREC IND CO LTD·Filed 2008·Granted Aug 9, 2011·4 cites·4 claims
- 1762US7335982B2Chip package structure and chip packaging processADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Feb 26, 2008·2 cites·13 claims
- 1857US7973244B2Printed circuit boardHON HAI PREC IND CO LTD·Filed 2007·Granted Jul 5, 2011·1 cites·8 claims
- 1956US8154879B2MotherboardCHAO CHIH-HANG·Filed 2007·Granted Apr 10, 2012·1 cites·10 claims
- 2056US7451466B2Feeding mechanism for pickup headHON HAI PREC IND CO LTD·Filed 2006·Granted Nov 11, 2008·0 cites·6 claims
- 2155US6891274B2Under-bump-metallurgy layer for improving adhesionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted May 10, 2005·6 cites·25 claims
- 2249US8035034B2Printed circuit boardHON HAI PREC IND CO LTD·Filed 2008·Granted Oct 11, 2011·0 cites·10 claims
- 2349US2014321078A1Display deviceHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 2448US7763817B2Button assemblyHONGFUJIN PREC IND SHENZHEN·Filed 2008·Granted Jul 27, 2010·0 cites·10 claims
- 2548US2009071698A1Circuit boardHON HAI PREC IND CO LTD·Filed 2007·Application pending·0 cites
- 2647US7447014B2Bracket assembly for disk drive and a method of assembling a bracket to an enclosure for preventing resonanceHONGFUJIN PREC IND SHENZHEN·Filed 2006·Granted Nov 4, 2008·0 cites·15 claims
- 2747US2010002373A1Heat dissipating device for electronic deviceHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 2847US2010128442A1Heat sink assemblyHONGFUJIN PREC IND SHENZHEN·Filed 2009·Application pending·0 cites
- 2947US2012267148A1Circuit boardLIN YU-HSU·Filed 2012·Application pending·0 cites
- 3046US2009213549A1Heat sink assemblyHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3146US2010014244A1Thermal device for heat generating sourceHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3246US2009168361A1Printed circuit board assemblyHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3346US2007128019A1BlowerHON HAI PREC IND CO LTD·Filed 2006·Application pending·0 cites
- 3446US2007140836A1BlowerHON HAI PREC IND CO LTD·Filed 2006·Application pending·0 cites
- 3545US8154125B2Chip package structureWU JENG-DA·Filed 2008·Granted Apr 10, 2012·0 cites·19 claims
- 3645US2009168330A1Electronic device with airflow guiding ductHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3745US2009166062A1Printed circuit board assemblyHONGFUJIN PREC IND SHENZHEN·Filed 2008·Application pending·0 cites
- 3845US2005200014A1Bump and fabricating process thereofFiled 2005·Application pending·0 cites
- 3945US2014289688A1Method and system for testing direct current transmission layout of printed circuit boardHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 4044US9693142B2Housing of electronic device and speakerHONG FU JIN PREC IND (WUHAN) CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·18 claims
- 4144US6972489B2Flip chip package with thermometerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 6, 2005·2 cites·22 claims
- 4242US2008089031A1Heat sink assemblyHON HAI PREC IND CO LTD·Filed 2006·Application pending·0 cites
- 4342US2014358501A1Method and system for modeling current transmission on printed circuit boardHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 4442US2008073069A1Heat sinkHON HAI PREC IND CO LTD·Filed 2006·Application pending·0 cites
- 4542US2008088035A1Circuit board assemblyHON HAI PREC IND CO LTD·Filed 2006·Application pending·0 cites
- 4640US2005275098A1Lead-free conductive jointing bumpADVANCE SEMICONDUCTOR ENGINEER·Filed 2005·Application pending·0 cites
- 4740US2004065949A1[solder bump]Filed 2003·Application pending·0 cites
- 4839US7042078B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 9, 2006·0 cites·4 claims
- 4938US2011188208A1Heat dissipating systemHON HAI PREC IND CO LTD·Filed 2010·Application pending·0 cites
- 5038US2005263883A1Asymmetric bump structureADVANCE SEMICONDUCTOR ENGINEER·Filed 2005·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →