Inventor · disambiguated record
Wayne A. Nunn
Also filed as: NUNN WAYNE · NUNN WAYNE A
3 granted patents·2 pending applications·6 citations·filing 2003–2013
57Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0167US8482114B2Impedance optimized chip systemSPEHAR JAMES RAYMOND·Filed 2010·Granted Jul 9, 2013·5 cites·9 claims
- 0249US7911057B2Bumpless flip-chip assembly with a complaint interposer contractorNXP BV·Filed 2006·Granted Mar 22, 2011·1 cites·9 claims
- 0341US2013268909A1Impedance optimized chip systemNXP BV·Filed 2013·Application pending·0 cites
- 0432US2006125079A1High density package interconnect wire bond strip line and method thereforWYLAND CHRIS·Filed 2003·Application pending·0 cites
- 0529US9837188B2Differential return loss supporting high speed bus interfacesNXP BV·Filed 2013·Granted Dec 5, 2017·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →