Assignee
WYLAND CHRIS
US·6 granted patents·1 pending application·28 citations·filing 2003–2007
Top patents by PatentIndex Score
7 records- 0177US8203219B2Electrically enhanced wirebond packageWYLAND CHRIS·Filed 2007·Granted Jun 19, 2012·9 cites·20 claims
- 0275US8399982B2Nanotube-based directionally-conductive adhesiveWYLAND CHRIS·Filed 2005·Granted Mar 19, 2013·8 cites·21 claims
- 0365US8134073B2Method and system for composite bond wiresWYLAND CHRIS·Filed 2007·Granted Mar 13, 2012·4 cites·18 claims
- 0463US8681500B2Integrated circuit nanotube-based subsrateWYLAND CHRIS·Filed 2005·Granted Mar 25, 2014·3 cites·24 claims
- 0558US8848372B2Nanotube-based fluid interface material and approachWYLAND CHRIS·Filed 2005·Granted Sep 30, 2014·3 cites·20 claims
- 0655US8237516B2Enhanced substrate using metamaterialsWYLAND CHRIS·Filed 2006·Granted Aug 7, 2012·1 cites·22 claims
- 0732US2006125079A1High density package interconnect wire bond strip line and method thereforWYLAND CHRIS·Filed 2003·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →