Inventor · disambiguated record
David Bernhard
Also filed as: BERNHARD DAVID · BERNHARD DAVID D · BERNHARD DAVID DANIEL
28 granted patents·14 pending applications·732 citations·filing 2000–2016
97Inventor score
Files withADVANCED TECH MATERIALS23MINSEK DAVID W3RATH MELISSA K3ADVANCED TECHNOLOGIES MATERIAL1BERNHARD DAVID1
Top patents by PatentIndex Score
42 records- 0196US6773873B2pH buffered compositions useful for cleaning residue from semiconductor substratesADVANCED TECH MATERIALS·Filed 2002·Granted Aug 10, 2004·115 cites·14 claims
- 0295US6896826B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted May 24, 2005·74 cites·49 claims
- 0393US8951948B2Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal compositionRATH MELISSA K·Filed 2006·Granted Feb 10, 2015·21 cites·15 claims
- 0492US8058219B2Metals compatible post-etch photoresist remover and/or sacrificial antireflective coating etchantRATH MELISSA K·Filed 2006·Granted Nov 15, 2011·25 cites·20 claims
- 0592US7300601B2Passivative chemical mechanical polishing composition for copper film planarizationADVANCED TECH MATERIALS·Filed 2002·Granted Nov 27, 2007·45 cites·79 claims
- 0692US6692546B2Chemical mechanical polishing compositions for metal and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Feb 17, 2004·70 cites·39 claims
- 0791US6344432B1Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECH MATERIALS·Filed 2000·Granted Feb 5, 2002·51 cites·14 claims
- 0890US7994108B2Composition useful for removal of post-etch photoresist and bottom anti-reflection coatingsADVANCED TECH MATERIALS·Filed 2006·Granted Aug 9, 2011·11 cites·18 claims
- 0990US6755989B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2001·Granted Jun 29, 2004·43 cites·12 claims
- 1089US7605113B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2005·Granted Oct 20, 2009·11 cites·22 claims
- 1189US7029373B2Chemical mechanical polishing compositions for metal and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Apr 18, 2006·47 cites·40 claims
- 1288US8236485B2Photoresist removalMINSEK DAVID W·Filed 2003·Granted Aug 7, 2012·33 cites·25 claims
- 1387US9256134B2Photoresist removalADVANCED TECH MATERIALS·Filed 2014·Granted Feb 9, 2016·5 cites·16 claims
- 1487US6800218B2Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2001·Granted Oct 5, 2004·36 cites·36 claims
- 1585US6849200B2Composition and process for wet stripping removal of sacrificial anti-reflective materialADVANCED TECH MATERIALS·Filed 2002·Granted Feb 1, 2005·45 cites·23 claims
- 1682US8338087B2Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrateRATH MELISSA K·Filed 2004·Granted Dec 25, 2012·19 cites·41 claims
- 1781US7678393B1Mixture composition and method useful for topical and internal applicationDB LAB LLC·Filed 2007·Granted Mar 16, 2010·12 cites·1 claims
- 1880US8679734B2Photoresist removalMINSEK DAVID W·Filed 2012·Granted Mar 25, 2014·3 cites·20 claims
- 1979US6458984B1Chemical method for removal and analysis of boron impurities in tetraethylorthosilicate (TEOS)ADVANCED TECH MATERIALS·Filed 2000·Granted Oct 1, 2002·13 cites·32 claims
- 2078US6967169B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2004·Granted Nov 22, 2005·16 cites·13 claims
- 2176US7888301B2Resist, barc and gap fill material stripping chemical and methodADVANCED TECH MATERIALS·Filed 2004·Granted Feb 15, 2011·22 cites·32 claims
- 2276US7662762B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substratesADVANCED TECH MATERIALS·Filed 2005·Granted Feb 16, 2010·4 cites·20 claims
- 2365US9422513B2Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal compositionENTEGRIS INC·Filed 2014·Granted Aug 23, 2016·0 cites·14 claims
- 2463US6660700B2Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structuresADVANCED TECHNOLOGIES MATERIAL·Filed 2001·Granted Dec 9, 2003·10 cites·14 claims
- 2560US8765804B2Pharmaceutical compositions comprising lignans and their derivatives for treating hyperplastic diseasesSTUPPNER HERMANN·Filed 2009·Granted Jul 1, 2014·0 cites·10 claims
- 2657US2013109605A1Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrateADVANCED TECH MATERIALS·Filed 2012·Application pending·0 cites
- 2756US9109188B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2012·Granted Aug 18, 2015·0 cites·13 claims
- 2856US8293694B2Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateWOJTCZAK WILLIAM A·Filed 2009·Granted Oct 23, 2012·1 cites·19 claims
- 2955US2007181852A1Passivative chemical mechanical polishing composition for copper film planarizationLIU JUN·Filed 2007·Application pending·0 cites
- 3055US2015344826A1Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrateADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
- 3154US2016152926A1Photoresist removalADVANCED TECH MATERIALS·Filed 2016·Application pending·0 cites
- 3248US2006154186A1Composition useful for removal of post-etch photoresist and bottom anti-reflection coatingsADVANCED TECH MATERIALS·Filed 2005·Application pending·0 cites
- 3348US2006160475A1Chemical mechanical polishing compositions for metal and associated materials and method of using sameMA YING·Filed 2006·Application pending·0 cites
- 3447US2006063687A1Composition and process for ashless removal of post-etch photoresist and/or bottom anti-reflective material on a substrateMINSEK DAVID W·Filed 2004·Application pending·0 cites
- 3543US9669000B2Pharmaceutical compositions comprising lignans and their derivatives for treating hyperplastic diseasesUNIVERSITÄT INNSBRUCK·Filed 2014·Granted Jun 6, 2017·0 cites·10 claims
- 3643US2009212021A1Compositions and methods for selective removal of metal or metal alloy after metal silicide formationADVANCED TECH MATERIALS·Filed 2006·Application pending·0 cites
- 3742US2005026437A1Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using sameFiled 2004·Application pending·0 cites
- 3840US2009032766A1Composition and method for selectively etching gate spacer oxide materialADVANCED TECH MATERIALS·Filed 2006·Application pending·0 cites
- 3940US2008230076A1Cigarette FiltersWICK IMMUNOLOGISCHE DIAGNOSTIC·Filed 2006·Application pending·0 cites
- 4039US2006249482A1Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using sameWRSCHKA PETER·Filed 2004·Application pending·0 cites
- 4133US2017157301A1Leoligin derivatives as smooth muscle cell proliferation inhibitorsUNIV WIEN TECH·Filed 2015·Application pending·0 cites
- 4224US2013053438A1Pharmaceutical compositions comprising lignans and their derivatives for the medical management of angiogenesis and hypovascularityBERNHARD DAVID·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →