Inventor · disambiguated record
Joonggi Kim
Also filed as: KIM JOONGGI
2 granted patents·9 citations·filing 2011–2014
51Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0184US8952529B2Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voidsLEE JAEHYUN·Filed 2011·Granted Feb 10, 2015·9 cites·37 claims
- 0252US9679846B2Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voidsSTATS CHIPPAC LTD·Filed 2014·Granted Jun 13, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →