Assignee
LEE JAEHYUN
KR·5 granted patents·22 citations·filing 2011–2012
Top patents by PatentIndex Score
5 records- 0184US8952529B2Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voidsLEE JAEHYUN·Filed 2011·Granted Feb 10, 2015·9 cites·37 claims
- 0284US8642384B2Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliabilityLEE JAEHYUN·Filed 2012·Granted Feb 4, 2014·6 cites·25 claims
- 0371US9054100B2Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrateLEE JAEHYUN·Filed 2011·Granted Jun 9, 2015·3 cites·25 claims
- 0464US9230933B2Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structureLEE JAEHYUN·Filed 2011·Granted Jan 5, 2016·2 cites·15 claims
- 0564US8524538B2Integrated circuit packaging system with film assistance mold and method of manufacture thereofLEE JAEHYUN·Filed 2011·Granted Sep 3, 2013·2 cites·20 claims
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