Inventor · disambiguated record
Yul Kyo Chung
Also filed as: CHUNG YUL K · CHUNG YUL KYO
42 granted patents·42 pending applications·351 citations·filing 2006–2018
97Inventor score
Top patents by PatentIndex Score
84 records- 0197US9875970B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 23, 2018·46 cites·18 claims
- 0297US7293356B2Method of fabricating printed circuit board having embedded multi-layer passive devicesSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 13, 2007·124 cites·6 claims
- 0394US9462697B2Electronic component embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 4, 2016·13 cites·18 claims
- 0493US8633397B2Method of processing cavity of core substrateJEONG JIN-SOO·Filed 2010·Granted Jan 21, 2014·40 cites·11 claims
- 0591US9307632B2Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 5, 2016·14 cites·21 claims
- 0685US7736397B2Method for manufacturing capacitor embedded in PCBSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 15, 2010·15 cites·17 claims
- 0784US7609504B2High-dielectric constant metal-ceramic-polymer composite material and method for producing embedded capacitor using the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Oct 27, 2009·15 cites·26 claims
- 0880US8064215B2Semiconductor chip package and printed circuit boardCHUNG YUL-KYO·Filed 2008·Granted Nov 22, 2011·11 cites·4 claims
- 0979US7417870B2Multi-layer board with decoupling functionSAMSUNG ELECTRO MECH·Filed 2007·Granted Aug 26, 2008·9 cites·4 claims
- 1078US7540913B2Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Jun 2, 2009·5 cites·3 claims
- 1177US9788409B2Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 10, 2017·3 cites·7 claims
- 1277US8482890B2PCB strip and manufacturing method for electronic component embedded PCBKIM MOON-IL·Filed 2010·Granted Jul 9, 2013·6 cites·8 claims
- 1377US7730612B2Method of manufacturing component-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 8, 2010·7 cites·3 claims
- 1476US9788433B2Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 10, 2017·2 cites·8 claims
- 1576US9420683B2Substrate embedding passive elementSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 16, 2016·4 cites·8 claims
- 1676US8039759B2Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured therebySAMSUNG ELECTRO MECH·Filed 2007·Granted Oct 18, 2011·6 cites·12 claims
- 1774US9526177B2Printed circuit board including electronic component embedded therein and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 20, 2016·3 cites·10 claims
- 1873US9087837B2Semiconductor package and method of manufacturing the sameLEE DOO HWAN·Filed 2012·Granted Jul 21, 2015·2 cites·8 claims
- 1972US7485411B2Method for manufacturing printed circuit board with thin film capacitor embedded thereinSAMSUNG ELECTRO MECH·Filed 2007·Granted Feb 3, 2009·6 cites·14 claims
- 2071US7845073B2Method of manufacturing circuit board embedding thin film capacitorSAMSUNG ELECTRO MECH·Filed 2007·Granted Dec 7, 2010·3 cites·15 claims
- 2167US8871569B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 28, 2014·1 cites·20 claims
- 2267US8482310B2Test method for passive device embedded printed circuit boardKIM HYUN-HO·Filed 2010·Granted Jul 9, 2013·2 cites·2 claims
- 2365US10270948B2Substrate for camera module and camera module having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 23, 2019·1 cites·5 claims
- 2464US10015884B2Printed circuit board including embedded electronic component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 3, 2018·1 cites·7 claims
- 2563US7675756B2Thin film-capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 9, 2010·2 cites·12 claims
- 2661US9313893B2Substrate having electronic component embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Apr 12, 2016·1 cites·22 claims
- 2760US8618421B2Electronics component embedded PCBBYUN JUNG-SOO·Filed 2010·Granted Dec 31, 2013·2 cites·3 claims
- 2860US8547132B2Circuit board and method for testing component built in the circuit boardKIM HYUN HO·Filed 2010·Granted Oct 1, 2013·1 cites·10 claims
- 2958US8199456B2Capacitor and manufacturing method thereofLIM SUNG-TAEK·Filed 2008·Granted Jun 12, 2012·3 cites·19 claims
- 3058US7812465B2Semiconductor chip having alignment mark and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 12, 2010·1 cites·8 claims
- 3157US7927517B2Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Apr 19, 2011·0 cites·4 claims
- 3257US7887879B2Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 15, 2011·0 cites·4 claims
- 3356US9345141B2Multilayer ceramic capacitor and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 17, 2016·0 cites·28 claims
- 3456US8802999B2Embedded printed circuit board and manufacturing method thereofRYU JONG IN·Filed 2012·Granted Aug 12, 2014·1 cites·10 claims
- 3554US10887995B2Method for manufacturing a printed circuit board including an embedded electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 5, 2021·0 cites·11 claims
- 3654US8049117B2Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured therebySAMSUNG ELECTRO MECH·Filed 2009·Granted Nov 1, 2011·0 cites·16 claims
- 3754US7886436B2Thin film capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 15, 2011·0 cites·11 claims
- 3852US7943858B2Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitorSAMSUNG ELECTRO MECH·Filed 2008·Granted May 17, 2011·1 cites·18 claims
- 3952US2009208640A1Fabrication method of composite metal oxide dielectric film, and composite metal oxide dielectric film fabricated therebySAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 4051US10199329B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 5, 2019·0 cites·20 claims
- 4151US9155199B2Passive device embedded in substrate and substrate with passive device embedded thereinSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·0 cites·10 claims
- 4251US2014123486A1Method of processing cavity of core substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4351US2014182897A1Circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4450US2014177192A1Core substrate and method for manufacturing the same, and substrate with built-in electronic components and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4550US2014131084A1Capacitor embedded substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4650US2014151104A1Electronic component embedded substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4749US2007020955A1Fabrication method of composite metal oxide dielectric film, and composite metal oxide dielectric film fabricated therebySAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4849US2009277673A1PCB having electronic components embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4948US9474167B2Multilayered substrateSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 18, 2016·0 cites·15 claims
- 5048US2013139382A1Printed circuit board having electro component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
Showing the top 50 of 84 patent records by PatentIndex Score.
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