US2014123486A1PendingUtilityA1
Method of processing cavity of core substrate
Est. expiryAug 25, 2029(~3.1 yrs left)· nominal 20-yr term from priority
H10W 90/00H10W 74/019H10W 72/9413H10W 72/07131H10W 70/685H10W 70/682H10W 70/093H10W 70/614H05K 2201/10674H05K 3/0032H05K 3/4697H05K 2201/09781Y10T29/49124H05K 2203/0156H05K 1/185H05K 2203/1572H05K 3/007H05K 3/4602H05K 2203/0554
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Claims
Abstract
A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.
Claims
exact text as granted — not AI-modified1 . A method of processing a cavity of a core substrate, comprising:
forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.
2 . The method of claim 1 , wherein the second processing area is wider than the first processing area.
3 . The method of claim 2 , wherein a center of the first processing area and a center of the second processing area are placed on a same vertical line.
4 . The method of claim 3 , wherein the first processing area and the second processing area have a similar shape.
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