Inventor · disambiguated record
Patrick Reilly
Also filed as: REILLY PATRICK · REILLY PATRICK JAMES
15 granted patents·2 pending applications·126 citations·filing 2010–2023
92Inventor score
Files withAPPLIED MATERIALS INC13HAN XINHAI1REILLY PATRICK1SANKARAKRISHNAN RAMPRAKASH1SEAMONS MARTIN JAY1
Top patents by PatentIndex Score
17 records- 0197US9157730B2PECVD processAPPLIED MATERIALS INC·Filed 2013·Granted Oct 13, 2015·49 cites·18 claims
- 0296US9721784B2Ultra-conformal carbon film depositionAPPLIED MATERIALS INC·Filed 2014·Granted Aug 1, 2017·29 cites·16 claims
- 0396US9458537B2PECVD processAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·12 cites·20 claims
- 0495US9816187B2PECVD processAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·8 cites·20 claims
- 0593US11613812B2PECVD processAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·2 cites·20 claims
- 0690US10793954B2PECVD processAPPLIED MATERIALS INC·Filed 2018·Granted Oct 6, 2020·3 cites·13 claims
- 0790US10060032B2PECVD processAPPLIED MATERIALS INC·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 0889US10074534B2Ultra-conformal carbon film depositionAPPLIED MATERIALS INC·Filed 2017·Granted Sep 11, 2018·5 cites·9 claims
- 0985US11898249B2PECVD processAPPLIED MATERIALS INC·Filed 2023·Granted Feb 13, 2024·0 cites·17 claims
- 1081US8679987B2Deposition of an amorphous carbon layer with high film density and high etch selectivityREILLY PATRICK·Filed 2012·Granted Mar 25, 2014·7 cites·20 claims
- 1176US8778813B2Confined process volume PECVD chamberSANKARAKRISHNAN RAMPRAKASH·Filed 2011·Granted Jul 15, 2014·4 cites·17 claims
- 1273US10030306B2PECVD apparatus and processAPPLIED MATERIALS INC·Filed 2013·Granted Jul 24, 2018·1 cites·16 claims
- 1367US8513129B2Planarizing etch hardmask to increase pattern density and aspect ratioSEAMONS MARTIN JAY·Filed 2010·Granted Aug 20, 2013·2 cites·13 claims
- 1464US9748093B2Pulsed nitride encapsulationAPPLIED MATERIALS INC·Filed 2016·Granted Aug 29, 2017·1 cites·9 claims
- 1546US2011151142A1Pecvd multi-step processing with continuous plasmaAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 1635US9646818B2Method of forming planar carbon layer by applying plasma power to a combination of hydrocarbon precursor and hydrogen-containing precursorAPPLIED MATERIALS INC·Filed 2016·Granted May 9, 2017·0 cites·14 claims
- 1731US2013161629A1Zero shrinkage smooth interface oxy-nitride and oxy-amorphous-silicon stacks for 3d memory vertical gate applicationHAN XINHAI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →