Inventor · disambiguated record
Alexander Platz
Also filed as: PLATZ ALEXANDER
4 granted patents·4 pending applications·26 citations·filing 2006–2013
74Inventor score
Files withADVANCED MICRO DEVICES INC2GLOBALFOUNDRIES INC2KUECHENMEISTER FRANK2LEHR MATTHIAS1UEBERREITER GUIDO1
Top patents by PatentIndex Score
8 records- 0178US8580672B2Methods of forming bump structures that include a protection layerKUECHENMEISTER FRANK·Filed 2011·Granted Nov 12, 2013·7 cites·15 claims
- 0274US8039958B2Semiconductor device including a reduced stress configuration for metal pillarsADVANCED MICRO DEVICES INC·Filed 2009·Granted Oct 18, 2011·6 cites·16 claims
- 0373US7829453B2Method for forming solder balls with a stable oxide layer by controlling the reflow ambientGLOBALFOUNDRIES INC·Filed 2006·Granted Nov 9, 2010·6 cites·24 claims
- 0472US7585759B2Technique for efficiently patterning an underbump metallization layer using a dry etch processADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 8, 2009·7 cites·29 claims
- 0548US2014021604A1Integrated circuit devices with bump structures that include a protection layerGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 0642US2010164098A1Semiconductor device including a cost-efficient chip-package connection based on metal pillarsKUECHENMEISTER FRANK·Filed 2009·Application pending·0 cites
- 0741US2008099913A1Metallization layer stack without a terminal aluminum metal layerLEHR MATTHIAS·Filed 2007·Application pending·0 cites
- 0833US2011291285A1Semiconductor Device Comprising a Die Seal with Graded Pattern DensityUEBERREITER GUIDO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →