Inventor · disambiguated record
Cheng Xu
Also filed as: XU CHENG · Xu cheng yan
44 granted patents·15 pending applications·54 citations·filing 2015–2024
96Inventor score
Top patents by PatentIndex Score
59 records- 0197US11557579B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2020·Granted Jan 17, 2023·5 cites·23 claims
- 0296US11696407B2Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrateINTEL CORP·Filed 2021·Granted Jul 4, 2023·3 cites·21 claims
- 0391US11521914B2Microelectronic assemblies having a cooling channelINTEL CORP·Filed 2018·Granted Dec 6, 2022·8 cites·13 claims
- 0491US11387224B2Phase change material in substrate cavityINTEL CORP·Filed 2018·Granted Jul 12, 2022·7 cites·20 claims
- 0590US11646254B2Electronic device including a lateral traceTAHOE RES LTD·Filed 2020·Granted May 9, 2023·2 cites·25 claims
- 0690US10804188B2Electronic device including a lateral traceINTEL CORP·Filed 2018·Granted Oct 13, 2020·5 cites·9 claims
- 0788US10373951B1Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2018·Granted Aug 6, 2019·4 cites·23 claims
- 0886US10400322B2Fabrication of thermally stable nanocavities and particle-in-cavity nanostructuresUNIV FLORIDA·Filed 2016·Granted Sep 3, 2019·3 cites·20 claims
- 0983US2024405006A1Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2024·Application pending·0 cites
- 1082US10643994B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2019·Granted May 5, 2020·2 cites·21 claims
- 1180US12087746B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1280US10209017B2Cryogenic heat transfer by a nanoporous surfaceUNIV FLORIDA·Filed 2015·Granted Feb 19, 2019·2 cites·20 claims
- 1377US11894282B2Vented lids for integrated circuit packagesINTEL CORP·Filed 2019·Granted Feb 6, 2024·2 cites·20 claims
- 1477US11557489B2Cavity structures in integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 17, 2023·2 cites·20 claims
- 1575US11721677B2Microelectronic assemblies having an integrated capacitorINTEL CORP·Filed 2018·Granted Aug 8, 2023·1 cites·24 claims
- 1674US11217534B2Galvanic corrosion protection for semiconductor packagesINTEL CORP·Filed 2017·Granted Jan 4, 2022·2 cites·20 claims
- 1773US10741947B2Plated through hole socketing coupled to a solder ball to engage with a pinINTEL CORP·Filed 2018·Granted Aug 11, 2020·2 cites·23 claims
- 1873US2023352385A1Electronic device including a lateral traceTAHOE RES LTD·Filed 2023·Application pending·0 cites
- 1972US12154715B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2022·Granted Nov 26, 2024·0 cites·25 claims
- 2072US11735537B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·23 claims
- 2171US11443892B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·17 claims
- 2270US12288744B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2022·Granted Apr 29, 2025·0 cites·11 claims
- 2370US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 2470US10790159B2Semiconductor package substrate with through-hole magnetic core inductor using conductive pasteINTEL CORP·Filed 2018·Granted Sep 29, 2020·1 cites·15 claims
- 2570US10777514B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2018·Granted Sep 15, 2020·1 cites·16 claims
- 2669US10971492B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 6, 2021·0 cites·21 claims
- 2768US11901115B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2868US2023187205A1Substrate package with glass dielectricINTEL CORP·Filed 2023·Application pending·0 cites
- 2968US2023369192A1Dual trace thickness for single layer routingINTEL CORP·Filed 2023·Application pending·0 cites
- 3066US11031360B2Techniques for an inductor at a second level interfaceINTEL CORP·Filed 2020·Granted Jun 8, 2021·0 cites·13 claims
- 3164US2022230800A1Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2022·Application pending·0 cites
- 3264US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 3360US11651885B2Magnetic core inductorsINTEL CORP·Filed 2017·Granted May 16, 2023·0 cites·11 claims
- 3456US11830809B2Magnetic structures in integrated circuit package supportsINTEL CORP·Filed 2020·Granted Nov 28, 2023·0 cites·19 claims
- 3556US11450471B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2018·Granted Sep 20, 2022·0 cites·19 claims
- 3656US11322290B2Techniques for an inductor at a first level interfaceINTEL CORP·Filed 2018·Granted May 3, 2022·0 cites·6 claims
- 3756US11246218B2Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrateINTEL CORP·Filed 2018·Granted Feb 8, 2022·0 cites·22 claims
- 3855US11417614B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2018·Granted Aug 16, 2022·0 cites·22 claims
- 3955US11380609B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2018·Granted Jul 5, 2022·0 cites·20 claims
- 4053US11769719B2Dual trace thickness for single layer routingINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·8 claims
- 4152US10770344B2Chamferless interconnect vias of semiconductor devicesGLOBALFOUNDRIES INC·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 4251US10970901B2Single-photo generating device and method and non-volatile computer-readable media thereofWISTRON CORP·Filed 2019·Granted Apr 6, 2021·0 cites·13 claims
- 4351US2020027728A1Substrate package with glass dielectricINTEL CORP·Filed 2018·Application pending·0 cites
- 4448US12512392B2Package structure for reducing warpage of plastic package wafer and method for manufacturing the sameNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·7 claims
- 4547US11355459B2Embedding magnetic material, in a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Jun 7, 2022·0 cites·25 claims
- 4647US10745816B2Transfer of vertically aligned ultra-high density nanowires onto flexible substratesUNIV FLORIDA·Filed 2016·Granted Aug 18, 2020·0 cites·14 claims
- 4747US2023197351A1Film capacitor on a glass substrateZHANG CHONG·Filed 2021·Application pending·0 cites
- 4846US11705389B2Vias for package substratesINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·24 claims
- 4946US11508636B2Multi-layer solution based deposition of dielectrics for advanced substrate architecturesINTEL CORP·Filed 2018·Granted Nov 22, 2022·0 cites·9 claims
- 5044US11502017B2Effective heat conduction from hotspot to heat spreader through package substrateINTEL CORP·Filed 2018·Granted Nov 15, 2022·0 cites·21 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Cheng Xu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →