Inventor · disambiguated record
Shishir Ray
Also filed as: RAY SHISHIR · RAY SHISHIR K
9 granted patents·8 pending applications·56 citations·filing 2014–2024
85Inventor score
Top patents by PatentIndex Score
17 records- 0196US9679810B1Integrated circuit having improved electromigration performance and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Jun 13, 2017·18 cites·15 claims
- 0292US10062692B1Field effect transistors with reduced parasitic resistances and methodGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 28, 2018·18 cites·18 claims
- 0392US9640423B2Integrated circuits and methods for their fabricationGLOBALFOUNDRIES INC·Filed 2015·Granted May 2, 2017·9 cites·18 claims
- 0484US9412658B2Constrained nanosecond laser anneal of metal interconnect structuresIBM·Filed 2014·Granted Aug 9, 2016·7 cites·19 claims
- 0571US9076645B1Method of fabricating an interlayer structure of increased elasticity modulusGLOBALFOUNDRIES INC·Filed 2014·Granted Jul 7, 2015·2 cites·20 claims
- 0668US10134876B2FinFETs with strained channels and reduced on state resistanceGLOBALFOUNDRIES INC·Filed 2017·Granted Nov 20, 2018·1 cites·15 claims
- 0764US9559166B2Fabricating transistors having resurfaced source/drain regions with stressed portionsGLOBALFOUNDRIES INC·Filed 2015·Granted Jan 31, 2017·1 cites·19 claims
- 0862US2025022775A13-dimensional integrated circuit structures and circuitsMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0961US2025015029A1Multi-die-to-wafer hybrid bondingMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1053US2025226279A1Area effective heat sinkMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1153US2024145447A1Integration of Discrete Embeddable Capacitors on Integrated Circuit ChipsPSEMI CORP·Filed 2022·Application pending·0 cites
- 1253US2024213139A1Backside Deep Trench Capacitor and Inductor StructuresPSEMI CORP·Filed 2022·Application pending·0 cites
- 1348US2017236780A1Integrated circuit having improved electromigration performance and method of forming sameGLOBALFOUNDRIES INC·Filed 2017·Application pending·0 cites
- 1443US2015287824A1Integrated circuits with stressed semiconductor substrates and processes for preparing integrated circuits including the stressed semiconductor substratesGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 1538US9570291B2Semiconductor substrates and methods for processing semiconductor substratesGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 14, 2017·0 cites·14 claims
- 1637US9673039B2Devices comprising high-K dielectric layer and methods of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 6, 2017·0 cites·12 claims
- 1734US2018040505A1Method for forming a shallow trench isolation structure using a nitride liner and a diffusionless annealGLOBALFOUNDRIES INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →