Inventor · disambiguated record
Seung-Ki Chae
Also filed as: CHAE SEUNG-KI
28 granted patents·23 pending applications·247 citations·filing 1995–2011
96Inventor score
Top patents by PatentIndex Score
51 records- 0191US7951653B1Methods of manufacturing a semiconductor device using compositions for etching copperSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 31, 2011·15 cites·13 claims
- 0291US7556712B2Laser cleaning of backside of wafer for photolithographic processingSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 7, 2009·19 cites·5 claims
- 0382US7880138B2Apparatus and method for analyzing contaminants on waferSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 1, 2011·9 cites·20 claims
- 0482US7335601B2Method of processing an object and method of controlling processing apparatus to prevent contamination of the objectSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 26, 2008·9 cites·17 claims
- 0582US6869500B2Method for processing a wafer and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 22, 2005·35 cites·36 claims
- 0680US6910954B2Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of useSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jun 28, 2005·29 cites·30 claims
- 0776US7497963B2Etching methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 3, 2009·7 cites·11 claims
- 0874US8361274B2Etching apparatus and etching methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 29, 2013·6 cites·12 claims
- 0974US7985297B2Method of cleaning a quartz partSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jul 26, 2011·3 cites·19 claims
- 1074US6039770ASemiconductor device manufacturing system having means for reducing a pressure difference between loadlock and processing chambersSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 21, 2000·47 cites·17 claims
- 1165US7879736B2Composition for etching silicon oxide and method of forming a contact hole using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 1, 2011·2 cites·12 claims
- 1264US7417709B2Method and apparatus for exposing semiconductor substratesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 26, 2008·2 cites·20 claims
- 1363US7687448B2Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the compositionSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 30, 2010·0 cites·14 claims
- 1463US6814835B2Apparatus and method for supplying chemicals in chemical mechanical polishing systemsSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 9, 2004·8 cites·14 claims
- 1561US8455359B2Semiconductor devices and methods of manufacturing the sameKIM KOOK-JOO·Filed 2011·Granted Jun 4, 2013·3 cites·20 claims
- 1661US8083507B2Vacuum pump having rotation body cleaning unit with spraying holes on an output surface of the cleaning body surrounding a shaftPARK TEA-JIN·Filed 2008·Granted Dec 27, 2011·2 cites·15 claims
- 1760US7170070B2Ion implanters having an arc chamber that affects ion current densitySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 30, 2007·1 cites·21 claims
- 1858US6602323B2Method and apparatus for reducing PFC emission during semiconductor manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 5, 2003·6 cites·17 claims
- 1956US7608540B2Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the compositionSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 27, 2009·0 cites·18 claims
- 2052US5833425ASemiconductor device manufacturing apparatus employing vacuum systemSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 10, 1998·18 cites·5 claims
- 2149US6071350ASemiconductor device manufacturing apparatus employing vacuum systemSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jun 6, 2000·16 cites·6 claims
- 2249US2007263194A1Method of exposing a wafer to a light, and reticle, reticle assembly and exposing apparatus for performing the samePARK BYONG-CHEOL·Filed 2007·Application pending·0 cites
- 2345US7976785B2Apparatus for decomposing perfluorinated compounds and system for processing perfluorinated compounds using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 12, 2011·0 cites·12 claims
- 2445US2006110534A1Methods and apparatus for forming a titanium nitride layerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 2544US2012183696A1Plating method using analysis photoresist residue in plating solutionPARK JUNG-DAE·Filed 2011·Application pending·0 cites
- 2644US2006169201A1Apparatus for supplying gas and apparatus for forming a layer having the sameHWANG WAN-GOO·Filed 2006·Application pending·0 cites
- 2743US7265818B2Method of exposing a wafer to a light, and reticle, reticle assembly and exposing apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 4, 2007·0 cites·15 claims
- 2843US2008294382A1Method and apparatus for pump fault predictionSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2943US2005092245A1Plasma chemical vapor deposition apparatus having an improved nozzle configurationFiled 2004·Application pending·0 cites
- 3043US2006175304A1Method of forming layers on substrates using microwave energy and apparatus for performing the sameHWANG WAN-GOO·Filed 2006·Application pending·0 cites
- 3142US7112810B2Ion implanting apparatus and ion implanting method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 26, 2006·1 cites·23 claims
- 3242US2005130451A1Method for processing a wafer and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 3341US7040336B2Gas delivery system for supplying gas to semiconductor manufacturing equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 9, 2006·1 cites·22 claims
- 3441US2004173307A1Apparatus and method for supplying chemicals in chemical mechanical polishing systemsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 3541US2007102023A1Apparatus for treating substrates with phosphoric acid solution and method for regenerating the phosphoric acid solution employed thereinYI HUN-JUNG·Filed 2006·Application pending·0 cites
- 3640US2005111936A1Multi-chamber systemFiled 2004·Application pending·0 cites
- 3740US2005220576A1Substrate manufacturing apparatus and substrate transfer module used thereinSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 3840US2005217053A1Robot arm mechanismSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 3940US2011073801A1Composition for etching silicon oxide and method of forming a contact hole using the sameHWANG DONG-WON·Filed 2010·Application pending·0 cites
- 4040US2005095111A1Wafer transfer apparatusFiled 2004·Application pending·0 cites
- 4138US2005087139A1Antenna for use in producing plasma and plasma processing apparatus comprising the sameFiled 2004·Application pending·0 cites
- 4237US2006110533A1Methods and apparatus for forming a titanium nitride layerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4336US2006121737A1Method of manufacturing a semiconductor device and method of manufacturing a thin layer using the sameHAN JAE-HYUN·Filed 2005·Application pending·0 cites
- 4436US2008000502A1Compositions for cleaning a probe card and methods of cleaning a probe card using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4535US5654205AApparatus and method for depositing particles onto a waferSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Aug 5, 1997·5 cites·14 claims
- 4635US2005022742A1Chemical vapor deposition processing equipment for use in fabricating a semiconductor deviceFiled 2004·Application pending·0 cites
- 4735US2004222188A1Method of cleaning a deposition chamber and apparatus for depositing a metal on a substrateFiled 2004·Application pending·0 cites
- 4834US2005127192A1Endpoint detector for a substrate manufacturing processFiled 2004·Application pending·0 cites
- 4933US2007000523A1Cleaning composition and related methodsKIM SE-YEON·Filed 2006·Application pending·0 cites
- 5032US5746832AApparatus for depositing particles onto a waferSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 5, 1998·3 cites·3 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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