Inventor · disambiguated record
Chuan-Chi Tseng
Also filed as: TSENG CHUAN-CHI
3 granted patents·14 pending applications·5 citations·filing 2016–2018
57Inventor score
Files withTAI SOL ELECTRONICS CO LTD17
Top patents by PatentIndex Score
17 records- 0184US10605540B2Vapor chamber that utilizes a capillary structure and bumps to form a liquid-vapor channelTAI SOL ELECTRONICS CO LTD·Filed 2018·Granted Mar 31, 2020·3 cites·9 claims
- 0247US2019339022A1Loop vapor chamberTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0346US2019339020A1Loop vapor chamber conducive to separation of liquid and gasTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0445US10240873B2Joint assembly of vapor chambersTAI SOL ELECTRONICS CO LTD·Filed 2017·Granted Mar 26, 2019·0 cites·6 claims
- 0545US2019160600A1Method of manufacturing exhaust-pipe-free vapor chamberTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0645US2019316848A1Loop heat pipe with fluid slug pipeTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0745US2019331430A1Loop heat pipe partitioned into vapor channel and liquid channelTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0844US2019331431A1Loop heat pipe with different pipe diametersTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 0944US2019113290A1Vapor chamber with inner ridge forming passageTAI SOL ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1043US2019242655A1Flat heat pipe with composite wick materialTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1140US2017363367A1Heat dissipation deviceTAI-SOL ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1240US2017160018A1Heat pipe with fiber wick structureTAI-SOL ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1336US2019335619A1Loop heat transfer device with gaseous and liquid working fluid channels separated by partition wallTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1436US2019339021A1Joint vapor chamber assembly with vapor chambers connected by extension wick layerTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1535USD909979SVapor chamberTAI SOL ELECTRONICS CO LTD·Filed 2017·Granted Feb 9, 2021·2 cites·1 claims
- 1635US2019331432A1Loop heat pipe having condensation segment partially filled with wickTAI SOL ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1731US2017350657A1Heat spreader with a liquid-vapor separation structureTAI-SOL ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →