Heat dissipation device
Abstract
A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat dissipation device, comprising:
a heat spreader having a first plate and a second plate, wherein the first plate and the second plate are connected to form a receiving space therebetween, and the receiving space is defined with a heated area; a first capillary material provided on either or both of the first plate and the second plate and located in the heated area; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe has an end connected to the heat spreader and an opposite end located outside the heat spreader and closed; a second capillary material provided on an inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion located in the receiving space and another portion extending into the cavity, the portion of the fiber bundle that is located in the receiving space is provided on either or both of the first plate and the second plate and is in contact with the first capillary material, and the portion of the fiber bundle that extends into the cavity is in contact with the second capillary material on the inner wall of the heat pipe; and a working fluid in the receiving space and the cavity.
2 . The heat dissipation device of claim 1 , wherein the heat pipe extends through a fin assembly.
3 . The heat dissipation device of claim 1 , wherein the first capillary material is composed of sintered copper powder or a woven net.
4 . The heat dissipation device of claim 1 , wherein the second capillary material is composed of sintered copper powder, a woven net, or a groove.
5 . The heat dissipation device of claim 1 , wherein the receiving space further has a partition formed with a plurality of channels, the partition abuts against a portion of the first plate and a portion of the second plate and separates the heated area from the cavity, the heated area and the cavity are in communication with each other through the channels, and the fiber bundle is provided in some of the channels.
6 . The heat dissipation device of claims 1 , wherein the heat pipe does not correspond in position to the heated area.
7 . The heat dissipation device of claim 5 , wherein the heat pipe does not correspond in position to the heated area.Join the waitlist — get patent alerts
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