Vapor chamber with inner ridge forming passage
Abstract
A vapor chamber with an inner ridge forming passages, including: a first board having, defined thereon, a heating region, a thermally-insulating region and a condensing region; a second board coupled to the first board; a first wick disposed at the second board or the first board and extending from the heating region to the thermally-insulating region at the very least; and a working fluid. An inner ridge protrudes from the first board toward the second board and has bumps spaced apart by a predetermined distance. Some of the bumps are slender, flank predetermined routes, and are spaced apart to form passages, with the passages extending from the heating region to the condensing region via the thermally-insulating region. Ends of the bumps press against the first wick or the second board.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A vapor chamber with an inner ridge forming passages, comprising:
a first board having, defined thereon, a heating region, a thermally-insulating region and a condensing region; a second board coupled to the first board, allowing a receiving space to be formed between the first board and the second board and hermetically sealed; a first wick disposed at one of the second board and the first board and extending from the heating region to the thermally-insulating region at the very least; and a working fluid for filling the receiving space; characterized in that: an inner ridge protrudes from the first board, reaches the receiving space, and has bumps spaced apart by a predetermined distance, wherein some of the bumps are slender, flank predetermined routes, and are spaced apart to form passages, with the passages extending from the heating region to the condensing region via the thermally-insulating region; ends of the bumps press against the first wick or press against the first wick and the second board.
2 . The vapor chamber with an inner ridge forming passages according to claim 1 , wherein the first wick is formed by one of mesh and sintering copper powders, planar, and covers the heating region and the thermally-insulating region, whereas the ends of the bumps disposed at the heating region and the thermally-insulating region press against the first wick, and the bumps disposed at the condensing region press against the second board.
3 . The vapor chamber with an inner ridge forming passages according to claim 2 , further comprising at least a second wick disposed at one of the first board and the second board, being in contact with the first wick, each being slender, each being of a predetermined thickness, extending from the heating region to the condensing region via the thermally-insulating region, and disposed in portions of the passages.
4 . The vapor chamber with an inner ridge forming passages according to claim 3 , wherein the at least a second wick is one of fiber bundles, copper powders and mesh.
5 . The vapor chamber with an inner ridge forming passages according to claim 2 , wherein the first wick further covers the condensing region, and the ends of the bumps press against the first wick fully.
6 . The vapor chamber with an inner ridge forming passages according to claim 1 , wherein the first wick is slender and of a predetermined thickness, extends from the heating region to the condensing region via the thermally-insulating region, and lies in one of the passages.
7 . The vapor chamber with an inner ridge filming passages according to claim 1 , wherein a width of a gap between any two adjacent bumps beside any one of the passages is smaller than or equal to a width of the passage.
8 . The vapor chamber with an inner ridge forming passages according to claim 1 , wherein the inner ridge protrudes from a side of the first board, and the side of the first board faces the second board.
9 . The vapor chamber with an inner ridge forming passages according to claim 1 , wherein the inner ridge is formed on the first board by sintering copper powders thereon.Join the waitlist — get patent alerts
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