Inventor · disambiguated record
Sang-Rok Hah
Also filed as: HAH SANG-ROK
43 granted patents·14 pending applications·570 citations·filing 2000–2010
98Inventor score
Top patents by PatentIndex Score
57 records- 0192US6626968B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 30, 2003·53 cites·27 claims
- 0290US7488235B2Polishing apparatus and related polishing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·17 cites·16 claims
- 0387US6565736B2Wet process for semiconductor device fabrication using anode water containing oxidative substances and cathode water containing reductive substances, and anode water and cathode water used in the wet processSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 20, 2003·42 cites·23 claims
- 0486US6517412B2Method of controlling wafer polishing time using sample-skip algorithm and wafer polishing using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·40 cites·25 claims
- 0585US6924228B2Method of forming a via contact structure using a dual damascene techniqueSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 2, 2005·42 cites·27 claims
- 0684US6610596B1Method of forming metal interconnection using plating and semiconductor device manufactured by the methodSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Aug 26, 2003·33 cites·14 claims
- 0783US6540935B2Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 1, 2003·30 cites·25 claims
- 0880US6914001B2Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 5, 2005·20 cites·17 claims
- 0978US7196010B2Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 27, 2007·16 cites·34 claims
- 1078US7153370B2Method of cleaning semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 26, 2006·5 cites·16 claims
- 1178US7066785B2Polishing apparatus and related polishing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 27, 2006·21 cites·17 claims
- 1275US6860277B2Single type of semiconductor wafer cleaning deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 1, 2005·16 cites·20 claims
- 1375US6649471B2Method of planarizing non-volatile memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 18, 2003·20 cites·40 claims
- 1473US6924207B2Method of fabricating a metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 2, 2005·18 cites·20 claims
- 1573US6843257B2Wafer cleaning systemSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 18, 2005·16 cites·38 claims
- 1672US6585570B2Method and apparatus for supplying chemical-mechanical polishing slurriesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 1, 2003·15 cites·13 claims
- 1771US6699749B1Method for manufacturing a metal-insulator-metal capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 2, 2004·19 cites·20 claims
- 1870US6930054B2Slurry composition for use in chemical mechanical polishing of metal wiringSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 16, 2005·13 cites·18 claims
- 1970US6335287B1Method of forming trench isolation regionsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 1, 2002·14 cites·17 claims
- 2069US6855267B2Chemical mechanical polishing slurrySAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 15, 2005·10 cites·6 claims
- 2168US6976902B2Chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 20, 2005·12 cites·20 claims
- 2267US7807337B2Inductor for a system-on-a-chip and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Oct 5, 2010·4 cites·17 claims
- 2366US6506682B1Non-selective slurries for chemical mechanical polishing of metal layers and method for manufacturing thereofSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 14, 2003·10 cites·21 claims
- 2465US7183226B2Method of forming a trench for use in manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 27, 2007·11 cites·20 claims
- 2563US7157366B2Method of forming metal interconnection layer of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 2, 2007·12 cites·38 claims
- 2663US6514862B2Wafer polishing slurry and chemical mechanical polishing (CMP) method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 4, 2003·8 cites·21 claims
- 2760US6924234B2Method and apparatus for polishing a copper layer and method for forming a wiring structure using copperSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 2, 2005·6 cites·21 claims
- 2858US7781234B2Semiconductor process evaluation methods including variable ion implanting conditionsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 24, 2010·1 cites·18 claims
- 2958US7237561B2Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 3, 2007·5 cites·10 claims
- 3058US6548388B2Semiconductor device including gate electrode having damascene structure and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 15, 2003·9 cites·18 claims
- 3158US6254767B1Semiconductor device manufacturing apparatus having controller detecting function of filterSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jul 3, 2001·10 cites·36 claims
- 3253US2008166851A1Metal-insulator-metal (mim) capacitor and method for fabricating the sameHONG UK-SUN·Filed 2008·Application pending·0 cites
- 3353US2007155178A1Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3452US6716732B2Method for fabricating a contact pad of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 6, 2004·5 cites·20 claims
- 3552US6712078B2Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 30, 2004·3 cites·7 claims
- 3651US7144815B2Chemical mechanical polishing slurrySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 5, 2006·2 cites·5 claims
- 3749US6498102B2Method for planarizing a semiconductor device using ceria-based slurrySAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 24, 2002·2 cites·16 claims
- 3848US7089947B2Apparatus and method for cleaning a semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 15, 2006·2 cites·20 claims
- 3948US7033944B2Dual damascene processSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 25, 2006·3 cites·16 claims
- 4048US7017597B2Megasonic cleaning apparatus for fabricating semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 28, 2006·2 cites·14 claims
- 4147US2007117378A1Method of forming a trench for use in manufacturing a semiconductor deviceLEE SUNG-BAE·Filed 2007·Application pending·0 cites
- 4246US6518157B2Methods of planarizing insulating layers on regions having different etching ratesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·3 cites·29 claims
- 4346US2006270228A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 4446US2005148292A1Method and apparatus for polishing a copper layer and method for forming a wiring structure using copperSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4544US7972874B2Semiconductor process evaluation methods including variable ion implanting conditionsSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jul 5, 2011·0 cites·16 claims
- 4643US7135413B2Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 14, 2006·0 cites·24 claims
- 4741US2003231458A1Metal-insulator-metal (MIM) capacitor and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Application pending·0 cites
- 4840US2003201538A1Method of forming metal interconnection using plating and semiconductor device manufactured by the methodFiled 2003·Application pending·0 cites
- 4939US2005070090A1Method of forming metal pattern using selective electroplating processSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 5039US2002003123A1Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the sameFiled 2001·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →