Inventor · disambiguated record
Pin-Cheng Huang
Also filed as: HUANG PIN-CHENG
3 granted patents·4 pending applications·1 citations·filing 2011–2013
48Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0155US9720013B2Method of fabricating a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Aug 1, 2017·1 cites·11 claims
- 0243US2013326873A1Method of fabricating multi-chip stack package structure having inner layer heat-dissipating boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 0342US8987012B2Method of testing a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·10 claims
- 0437US8520391B2Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereofHUANG HUEI-NUAN·Filed 2011·Granted Aug 27, 2013·0 cites·15 claims
- 0536US2013020709A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 0634US2014073087A1Method of fabricating a semiconductor packageHUANG PIN-CHENG·Filed 2012·Application pending·0 cites
- 0731US2012168936A1Multi-chip stack package structure and fabrication method thereofHUANG PIN-CHENG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →