Inventor · disambiguated record
Al Vindasius
Also filed as: VINDASIUS AL
4 granted patents·2 pending applications·139 citations·filing 2004–2012
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0195US7215018B2Stacked die BGA or LGA component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted May 8, 2007·80 cites·14 claims
- 0294US7245021B2Micropede stacked die component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted Jul 17, 2007·59 cites·12 claims
- 0352US8729690B2Assembly having stacked die mounted on substrateINVENSAS CORP·Filed 2012·Granted May 20, 2014·0 cites·19 claims
- 0446US2007290377A1Three Dimensional Six Surface Conformal Die CoatingVERTICAL CIRCUITS INC·Filed 2007·Application pending·0 cites
- 0545US2009102038A1Chip scale stacked die packageVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 0640US7705432B2Three dimensional six surface conformal die coatingVERTICAL CIRCUITS INC·Filed 2004·Granted Apr 27, 2010·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →