Inventor · disambiguated record
Marcel Wieland
Also filed as: WIELAND MARCEL · WIELAND MARCEL B
8 granted patents·1 pending application·30 citations·filing 2005–2021
82Inventor score
Files withGLOBALFOUNDRIES INC4ADVANCED MICRO DEVICES INC2GLOBALFOUNDRIES DRESDEN MOD 12LEHR MATTHIAS1
Top patents by PatentIndex Score
9 records- 0185US10594356B1Methods, apparatus, and system for high-bandwidth on-mold antennasGLOBALFOUNDRIES INC·Filed 2019·Granted Mar 17, 2020·6 cites·17 claims
- 0281US7375032B2Semiconductor substrate thinning method for manufacturing thinned dieADVANCED MICRO DEVICES INC·Filed 2005·Granted May 20, 2008·11 cites·22 claims
- 0373US10411752B1Methods, apparatus, and system for high-bandwidth on-mold antennasGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 10, 2019·2 cites·20 claims
- 0472US9136234B2Semiconductor device with improved metal pillar configurationGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 15, 2015·3 cites·22 claims
- 0571US7491556B2Efficient method of forming and assembling a microelectronic chip including solder bumpsADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 17, 2009·6 cites·8 claims
- 0670US10580745B1Wafer level packaging with integrated antenna structuresGLOBALFOUNDRIES INC·Filed 2018·Granted Mar 3, 2020·2 cites·17 claims
- 0755US11907623B2Chip module structure and method and system for chip module design using chip-package co-optimizationGLOBALFOUNDRIES DRESDEN MOD 1·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 0851US11557421B2Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related methodGLOBALFOUNDRIES DRESDEN MOD 1·Filed 2020·Granted Jan 17, 2023·0 cites·14 claims
- 0941US2008099913A1Metallization layer stack without a terminal aluminum metal layerLEHR MATTHIAS·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →