Inventor · disambiguated record
Tetsuya Shirasu
Also filed as: SHIRASU TETSUYA
8 granted patents·4 pending applications·128 citations·filing 2004–2020
85Inventor score
Files withFUJITSU LTD5FUJITSU MICROELECTRONICS LTD3SANDISK TECHNOLOGIES LLC2SAKAMOTO MANABU1SHIRASU TETSUYA1
Top patents by PatentIndex Score
12 records- 0197US11011506B2Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 18, 2021·9 cites·12 claims
- 0297US10665580B1Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted May 26, 2020·104 cites·20 claims
- 0369US7348276B2Fabrication process of semiconductor device and polishing methodFUJITSU LTD·Filed 2005·Granted Mar 25, 2008·4 cites·24 claims
- 0464US7338905B2Semiconductor device manufacture methodFUJITSU LTD·Filed 2004·Granted Mar 4, 2008·8 cites·8 claims
- 0562US8991042B2Method for fabricating semiconductor deviceSAKAMOTO MANABU·Filed 2012·Granted Mar 31, 2015·1 cites·4 claims
- 0658US7258599B2Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor deviceFUJITSU LTD·Filed 2005·Granted Aug 21, 2007·1 cites·20 claims
- 0757US7597606B2Fabrication process of semiconductor device and polishing methodFUJITSU MICROELECTRONICS LTD·Filed 2008·Granted Oct 6, 2009·1 cites·9 claims
- 0852US2008119050A1Semiconductor device manufacture methodFUJITSU LTD·Filed 2008·Application pending·0 cites
- 0948US2009264054A1Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 1047US7842614B2Method for manufacturing semiconductor device and polisher used in the method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Granted Nov 30, 2010·0 cites·17 claims
- 1147US2010035523A1Semiconductor device fabricating method, and semiconductor fabricating deviceFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 1241US2012196512A1Polishing pad and method of fabricating semiconductor deviceSHIRASU TETSUYA·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →