Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device

Abstract

A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with the wafer is non-absorbable to a fluid. The tissue of the pedestal pad is dense and smooth, and does not have any cavity, such as fine holes, which holds the fluid.

1 . A polishing machine which supplies slurry on an abrasive pad attached on a rotating platen, presses a semiconductor wafer held on a head bottom against the abrasive pad, and polishes the semiconductor wafer, comprising:
 a discharge port of the cleaning fluid which is opened on top surface of the platen;   a pad opening which is opened on the abrasive pad located on the discharge port, and passes through the abrasive pad; and   head moving means which moves the head onto the discharge port and raises the head,   wherein during a period from after moving the head onto the discharge port at least until raising the head, the cleaning fluid continues being sprayed from the discharge port on a polished surface of the semiconductor wafer.   
     
     
         2 . The polishing machine according to  claim 1 , wherein the discharge port is opened so that the cleaning fluid is sprayed in a traveling direction of the rotating platen. 
     
     
         3 . A polishing machine which supplies slurry on an abrasive pad attached on a rotating platen, presses a semiconductor wafer held on a head bottom against the abrasive pad, and polishes the semiconductor wafer, comprising:
 a water tank which is positioned below the platen, and makes a cleaning fluid overflow; and   elevating means which moves the platen and the water tank vertically relative to each other, wherein   the platen is lowered relative to the water tank, and the abrasive pad attached on the platen is soaked in the cleaning fluid in the water tank.   
     
     
         4 . A polishing machine which supplies slurry on an abrasive pad attached on a rotating platen, presses a semiconductor wafer held on a head bottom against the abrasive pad, and polishes the semiconductor wafer, comprising:
 emergency stopping means which detects abnormality in the polishing machine, raises the head by adsorbing the semiconductor wafer thereto, and stops the platen rotation; and   emergency cleaning means which moves the raised head to a cleaning apparatus, and cleans a polished surface of the semiconductor wafer adsorbed to the head.