Inventor · disambiguated record
Michael S. Lacy
Also filed as: LACY MICHAEL · LACY MICHAEL S
13 granted patents·1 pending application·368 citations·filing 2000–2007
93Inventor score
Top patents by PatentIndex Score
14 records- 0198US6599765B1Apparatus and method for providing a signal port in a polishing pad for optical endpoint detectionLAM RES CORP·Filed 2001·Granted Jul 29, 2003·104 cites·11 claims
- 0294US7435161B2Multi-layer polishing pad material for CMPCABOT MICROELECTRONICS CORP·Filed 2005·Granted Oct 14, 2008·31 cites·14 claims
- 0393US6884156B2Multi-layer polishing pad material for CMPCABOT MICROELECTRONICS CORP·Filed 2003·Granted Apr 26, 2005·77 cites·38 claims
- 0492US6953515B2Apparatus and method for providing a signal port in a polishing pad for optical endpoint detectionLAM RES CORP·Filed 2003·Granted Oct 11, 2005·35 cites·11 claims
- 0589US6554688B2Method and apparatus for conditioning a polishing pad with sonic energyLAM RES CORP·Filed 2001·Granted Apr 29, 2003·37 cites·24 claims
- 0684US6547651B1Subaperture chemical mechanical planarization with polishing pad conditioningSTRASBAUGH·Filed 2000·Granted Apr 15, 2003·26 cites·23 claims
- 0775US6495464B1Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP toolLAM RES CORP·Filed 2000·Granted Dec 17, 2002·13 cites·33 claims
- 0873US6809031B1Method for manufacturing a reclaimable test pattern wafer for CMP applicationsLAM RES CORP·Filed 2000·Granted Oct 26, 2004·16 cites·18 claims
- 0965US6875091B2Method and apparatus for conditioning a polishing pad with sonic energyLAM RES CORP·Filed 2001·Granted Apr 5, 2005·12 cites·31 claims
- 1059US6945856B2Subaperture chemical mechanical planarization with polishing pad conditioningSTRASBAUGH·Filed 2003·Granted Sep 20, 2005·6 cites·15 claims
- 1156US6609961B2Chemical mechanical planarization belt assembly and method of assemblyLAM RES CORP·Filed 2001·Granted Aug 26, 2003·5 cites·32 claims
- 1251US6936133B2Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP toolLAM RES CORP·Filed 2002·Granted Aug 30, 2005·3 cites·27 claims
- 1351US6733615B2Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP toolLAM RES CORP·Filed 2002·Granted May 11, 2004·3 cites·31 claims
- 1443US2008274674A1Stacked polishing pad for high temperature applicationsCABOT MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Michael S. Lacy files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →