Assignee
STRASBAUGH
US·64 granted patents·6 pending applications·1,205 citations·filing 1997–2014
Top patents by PatentIndex Score
70 records- 0198US6520843B1High planarity chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Feb 18, 2003·111 cites·28 claims
- 0297US6551179B1Hard polishing pad for chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Apr 22, 2003·80 cites·20 claims
- 0394US7249992B2Method, apparatus and system for use in processing wafersSTRASBAUGH·Filed 2005·Granted Jul 31, 2007·77 cites·20 claims
- 0491US7033252B2Wafer carrier with pressurized membrane and retaining ring actuatorSTRASBAUGH·Filed 2005·Granted Apr 25, 2006·23 cites·10 claims
- 0590US6629874B1Feature height measurement during CMPSTRASBAUGH·Filed 2000·Granted Oct 7, 2003·37 cites·19 claims
- 0690US6602121B1Pad support apparatus for chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Aug 5, 2003·31 cites·13 claims
- 0790US6485354B1Polishing pad with built-in optical sensorSTRASBAUGH·Filed 2000·Granted Nov 26, 2002·26 cites·23 claims
- 0889US6346036B1Multi-pad apparatus for chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Feb 12, 2002·34 cites·20 claims
- 0987US7959496B2Flexible membrane assembly for a CMP system and method of usingSTRASBAUGH·Filed 2008·Granted Jun 14, 2011·14 cites·17 claims
- 1087US5964646AGrinding process and apparatus for planarizing sawed wafersSTRASBAUGH·Filed 1997·Granted Oct 12, 1999·76 cites·6 claims
- 1186US8968052B2Systems and methods of wafer grindingSTRASBAUGH·Filed 2012·Granted Mar 3, 2015·6 cites·26 claims
- 1285US8052504B2Method, apparatus and system for use in processing wafersSTRASBAUGH·Filed 2007·Granted Nov 8, 2011·12 cites·13 claims
- 1384US6547651B1Subaperture chemical mechanical planarization with polishing pad conditioningSTRASBAUGH·Filed 2000·Granted Apr 15, 2003·26 cites·23 claims
- 1483US7195541B2Endpoint detection system for wafer polishingSTRASBAUGH·Filed 2006·Granted Mar 27, 2007·6 cites·19 claims
- 1582US6743722B2Method of spin etching wafers with an alkali solutionSTRASBAUGH·Filed 2002·Granted Jun 1, 2004·25 cites·17 claims
- 1682US6739945B2Polishing pad with built-in optical sensorSTRASBAUGH·Filed 2001·Granted May 25, 2004·19 cites·23 claims
- 1781US9393669B2Systems and methods of processing substratesSTRASBAUGH·Filed 2013·Granted Jul 19, 2016·5 cites·18 claims
- 1881US7551979B2Robot calibration system and methodSTRASBAUGH·Filed 2006·Granted Jun 23, 2009·8 cites·13 claims
- 1981US6692339B1Combined chemical mechanical planarization and cleaningSTRASBAUGH·Filed 2000·Granted Feb 17, 2004·21 cites·20 claims
- 2081US5961169AApparatus for sensing the presence of a waferSTRASBAUGH·Filed 1998·Granted Oct 5, 1999·76 cites·10 claims
- 2180US6517419B1Shaping polishing pad for small head chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Feb 11, 2003·21 cites·10 claims
- 2280US6514129B1Multi-action chemical mechanical planarization device and methodSTRASBAUGH·Filed 2000·Granted Feb 4, 2003·21 cites·9 claims
- 2379US7063604B2Independent edge control for CMP carriersSTRASBAUGH·Filed 2005·Granted Jun 20, 2006·7 cites·13 claims
- 2479US6511368B1Spherical drive assembly for chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Jan 28, 2003·22 cites·19 claims
- 2579US6464574B1Pad quick release device for chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Oct 15, 2002·20 cites·17 claims
- 2678US6976901B1In situ feature height measurementSTRASBAUGH·Filed 2003·Granted Dec 20, 2005·21 cites·20 claims
- 2778US6726528B2Polishing pad with optical sensorSTRASBAUGH·Filed 2002·Granted Apr 27, 2004·19 cites·15 claims
- 2878US6696005B2Method for making a polishing pad with built-in optical sensorSTRASBAUGH·Filed 2002·Granted Feb 24, 2004·15 cites·7 claims
- 2977US6869348B1Retaining ring for wafer carriersSTRASBAUGH·Filed 2003·Granted Mar 22, 2005·16 cites·17 claims
- 3077US6855030B2Modular method for chemical mechanical planarizationSTRASBAUGH·Filed 2002·Granted Feb 15, 2005·20 cites·21 claims
- 3177US6527621B1Pad retrieval apparatus for chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Mar 4, 2003·18 cites·20 claims
- 3277US6045716AChemical mechanical polishing apparatus and methodSTRASBAUGH·Filed 1997·Granted Apr 4, 2000·59 cites·14 claims
- 3376US7008309B2Back pressure control system for CMP and wafer polishingSTRASBAUGH·Filed 2003·Granted Mar 7, 2006·15 cites·5 claims
- 3475US7040955B1Chemical-mechanical planarization tool force calibration method and systemSTRASBAUGH·Filed 2005·Granted May 9, 2006·5 cites·24 claims
- 3573US7052366B2Endpoint detection system for wafer polishingSTRASBAUGH·Filed 2004·Granted May 30, 2006·9 cites·6 claims
- 3671US7160808B2Chuck for supporting wafers with a fluidSTRASBAUGH·Filed 2004·Granted Jan 9, 2007·12 cites·10 claims
- 3771US6885206B2Device for supporting thin semiconductor wafersSTRASBAUGH·Filed 2003·Granted Apr 26, 2005·15 cites·4 claims
- 3871US6638389B2Method for applying an insert or tape to chucks or wafer carriers used for grinding, polishing, or planarizing wafersSTRASBAUGH·Filed 2002·Granted Oct 28, 2003·13 cites·2 claims
- 3971US6227956B1Pad quick release device for chemical mechanical polishingSTRASBAUGH·Filed 1999·Granted May 8, 2001·30 cites·21 claims
- 4071US6102057ALifting and rinsing a waferSTRASBAUGH·Filed 1999·Granted Aug 15, 2000·25 cites·1 claims
- 4170US9457446B2Methods and systems for use in grind shape control adaptationSTRASBAUGH·Filed 2013·Granted Oct 4, 2016·2 cites·3 claims
- 4270US7918712B2Endpoint detection system for wafer polishingSTRASBAUGH·Filed 2010·Granted Apr 5, 2011·1 cites·4 claims
- 4369US7018268B2Protection of work piece during surface processingSTRASBAUGH·Filed 2003·Granted Mar 28, 2006·13 cites·28 claims
- 4469US6514121B1Polishing chemical delivery for small head chemical mechanical planarizationSTRASBAUGH·Filed 2000·Granted Feb 4, 2003·12 cites·17 claims
- 4568US6887133B1Pad support method for chemical mechanical planarizationSTRASBAUGH·Filed 2003·Granted May 3, 2005·9 cites·9 claims
- 4667US6695681B2Endpoint detection system for wafer polishingSTRASBAUGH·Filed 2002·Granted Feb 24, 2004·7 cites·34 claims
- 4766US7238083B2Wafer carrier with pressurized membrane and retaining ring actuatorSTRASBAUGH·Filed 2006·Granted Jul 3, 2007·3 cites·6 claims
- 4866US7131892B2Wafer carrier with pressurized membrane and retaining ring actuatorSTRASBAUGH·Filed 2006·Granted Nov 7, 2006·3 cites·15 claims
- 4964US6884150B2Polishing pad sensor assembly with a damping padSTRASBAUGH·Filed 2002·Granted Apr 26, 2005·10 cites·20 claims
- 5062US7467990B2Back pressure control system for CMP and wafer polishingSTRASBAUGH·Filed 2006·Granted Dec 23, 2008·2 cites·13 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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