Inventor · disambiguated record
Yoshikuni Nakadaira
Also filed as: NAKADAIRA YOSHIKUNI
7 granted patents·4 pending applications·49 citations·filing 1996–2017
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0192US9137903B2Semiconductor chip assembly and method for making sameKANG TECK-GYU·Filed 2011·Granted Sep 15, 2015·13 cites·20 claims
- 0275US8890304B2Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer materialSATO HIROAKI·Filed 2011·Granted Nov 18, 2014·3 cites·21 claims
- 0365US8957520B2Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contactsSATO HIROAKI·Filed 2011·Granted Feb 17, 2015·2 cites·40 claims
- 0460US8525338B2Chip with sintered connections to packageSATO HIROAKI·Filed 2011·Granted Sep 3, 2013·1 cites·22 claims
- 0558US5763946ASemiconductor device with bent electrode terminalTOSHIBA KK·Filed 1996·Granted Jun 9, 1998·30 cites·20 claims
- 0657US9337165B2Method for manufacturing a fan-out WLP with packageTESSERA INC·Filed 2014·Granted May 10, 2016·0 cites·17 claims
- 0752US9716075B2Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2015·Granted Jul 25, 2017·0 cites·11 claims
- 0852US2017309593A1Semiconductor chip assembly and method for making sameTESSERA INC·Filed 2017·Application pending·0 cites
- 0949US2016254247A1Fan-out WLP with packageTESSERA INC·Filed 2016·Application pending·0 cites
- 1038US2012286416A1Semiconductor chip package assembly and method for making sameSATO HIROAKI·Filed 2011·Application pending·0 cites
- 1135US2006151878A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageJEONG SE-YOUNG·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshikuni Nakadaira files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →