Inventor · disambiguated record
Kimitaka Endo
Also filed as: ENDO KIMITAKA
15 granted patents·11 pending applications·242 citations·filing 2002–2016
93Inventor score
Files withINVENSAS CORP4TESSERA INC4ENDO KIMITAKA3TESSERA INTERCONNECT MATERIALS3NIPPON TELEGRAPH & TELEPHONE2
Top patents by PatentIndex Score
26 records- 0196US8299368B2Interconnection element for electric circuitsENDO KIMITAKA·Filed 2008·Granted Oct 30, 2012·69 cites·31 claims
- 0295US8119516B2Bump structure formed from using removable mandrelENDO KIMITAKA·Filed 2008·Granted Feb 21, 2012·59 cites·19 claims
- 0388US6884709B2Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrateNORTH CORP·Filed 2003·Granted Apr 26, 2005·50 cites·4 claims
- 0486US7238603B2Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrateTESSERA INTERCONNECT MATERIALS·Filed 2005·Granted Jul 3, 2007·13 cites·8 claims
- 0583US7923828B2Structure and method of making interconnect element, and multilayer wiring board including the interconnect elementTESSERA INTERCONNECT MATERIALS INC·Filed 2005·Granted Apr 12, 2011·16 cites·12 claims
- 0679US9282640B2Interconnection element with posts formed by platingTESSERA INC·Filed 2013·Granted Mar 8, 2016·5 cites·19 claims
- 0779US8505199B2Method of fabricating an interconnection element having conductive postsKWON JINSU·Filed 2008·Granted Aug 13, 2013·8 cites·26 claims
- 0867US8900464B2Method of making a microelectronic interconnect element with decreased conductor spacingINVENSAS CORP·Filed 2013·Granted Dec 2, 2014·1 cites·9 claims
- 0966US8859420B2Structure and method of making interconnect element, and multilayer wiring board including the interconnect elementENDO KIMITAKA·Filed 2011·Granted Oct 14, 2014·2 cites·19 claims
- 1065US8461460B2Microelectronic interconnect element with decreased conductor spacingRYU CHANG MYUNG·Filed 2009·Granted Jun 11, 2013·3 cites·13 claims
- 1164US7454421B2Database access control method, database access controller, agent processing server, database access control program, and medium recording the programNIPPON TELEGRAPH & TELEPHONE·Filed 2004·Granted Nov 18, 2008·16 cites·15 claims
- 1258US9524947B2Microelectronic interconnect element with decreased conductor spacingINVENSAS CORP·Filed 2014·Granted Dec 20, 2016·0 cites·9 claims
- 1356US9856135B2Microelectronic interconnect element with decreased conductor spacingINVENSAS CORP·Filed 2016·Granted Jan 2, 2018·0 cites·20 claims
- 1451US2013119012A1Interconnection element for electric circuitsTESSERA INTERCONNECT MATERIALS INC·Filed 2012·Application pending·0 cites
- 1551US2010044860A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerTESSERA INTERCONNECT MATERIALS·Filed 2009·Application pending·0 cites
- 1651US2009115047A1Robust multi-layer wiring elements and assemblies with embedded microelectronic elementsTESSERA INC·Filed 2008·Application pending·0 cites
- 1750US10032646B2Robust multi-layer wiring elements and assemblies with embedded microelectronic elementsTESSERA INC·Filed 2016·Granted Jul 24, 2018·0 cites·19 claims
- 1850US2010242270A1Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleIIJIMA TOMOO·Filed 2010·Application pending·0 cites
- 1949US2013186944A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerINVENSAS CORP·Filed 2013·Application pending·0 cites
- 2049US2009071707A1Multilayer substrate with interconnection vias and method of manufacturing the sameTESSERA INC·Filed 2008·Application pending·0 cites
- 2148US2010071944A1Chip capacitor embedded pwbTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 2242US2004201096A1Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleFiled 2004·Application pending·0 cites
- 2341US2005224256A1Interlayer member used for producing multilayer wiring board and method of producing the sameNORTH CORP·Filed 2005·Application pending·0 cites
- 2440US7617238B2System management method, system management device, system management program, and storage medium containing system management programNIPPON TELEGRAPH & TELEPHONE·Filed 2004·Granted Nov 10, 2009·0 cites·15 claims
- 2539US2007170598A1Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the sameSONY CHEMICALS CORP·Filed 2004·Application pending·0 cites
- 2632US2005097727A1Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring boardFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →