Assignee
ENDO KIMITAKA
JP·3 granted patents·130 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0196US8299368B2Interconnection element for electric circuitsENDO KIMITAKA·Filed 2008·Granted Oct 30, 2012·69 cites·31 claims
- 0295US8119516B2Bump structure formed from using removable mandrelENDO KIMITAKA·Filed 2008·Granted Feb 21, 2012·59 cites·19 claims
- 0366US8859420B2Structure and method of making interconnect element, and multilayer wiring board including the interconnect elementENDO KIMITAKA·Filed 2011·Granted Oct 14, 2014·2 cites·19 claims
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