Inventor · disambiguated record
Elie H. Najjar
Also filed as: NAJJAR ELIE · NAJJAR ELIE H
14 granted patents·6 pending applications·60 citations·filing 2001–2025
88Inventor score
Files withMACDERMID ENTHONE INC13ROHM & HAAS ELECT MAT4NAJJAR ELIE H1NIAZIMBETOVA ZUKHRA I1SHIPLEY CO LLC1
Top patents by PatentIndex Score
20 records- 0196US8268158B2Plating bath and methodNIAZIMBETOVA ZUKHRA I·Filed 2011·Granted Sep 18, 2012·20 cites·12 claims
- 0290US6827839B2Plating bath analysisSHIPLEY CO LLC·Filed 2001·Granted Dec 7, 2004·33 cites·8 claims
- 0384US11384446B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2020·Granted Jul 12, 2022·1 cites·12 claims
- 0483US9598787B2Method of filling through-holesROHM & HAAS ELECT MAT·Filed 2013·Granted Mar 21, 2017·3 cites·7 claims
- 0582US2024110306A1Compositions and Methods for the Electrodeposition of Nanotwinned CopperMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0680US11873568B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Granted Jan 16, 2024·0 cites·15 claims
- 0780US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 0873US12157944B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2023·Granted Dec 3, 2024·0 cites·37 claims
- 0968US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 1066US11846018B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2022·Granted Dec 19, 2023·0 cites·9 claims
- 1166US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 1260US11807951B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2021·Granted Nov 7, 2023·0 cites·16 claims
- 1357US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 1455US11230778B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2019·Granted Jan 25, 2022·0 cites·21 claims
- 1555US2011220512A1Plating bath and methodROHM & HAAS ELECT MAT·Filed 2010·Application pending·0 cites
- 1649US2024318342A1Compositions and methods for the eletrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Application pending·0 cites
- 1745US2014262801A1Method of filling through-holesROHM & HAAS ELECT MAT·Filed 2013·Application pending·0 cites
- 1843US10154598B2Filling through-holesROHM & HAAS ELECT MAT·Filed 2015·Granted Dec 11, 2018·0 cites·6 claims
- 1936US2018355502A1Process for metalization of copper pillars in the manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 2032US9365943B2Method of electroplating uniform copper layersNAJJAR ELIE H·Filed 2011·Granted Jun 14, 2016·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →