Assignee
MACDERMID ENTHONE INC
US·34 granted patents·23 pending applications·12 citations·filing 2014–2025
Top patents by PatentIndex Score
57 records- 0185US10443135B1Near neutral pH pickle on multi-metalsMACDERMID ENTHONE INC·Filed 2018·Granted Oct 15, 2019·4 cites·23 claims
- 0284US11384446B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2020·Granted Jul 12, 2022·1 cites·12 claims
- 0383US2024158941A1Gold Plating Bath and Gold Plated Final FinishMACDERMID ENTHONE INC·Filed 2024·Application pending·0 cites
- 0482US2024110306A1Compositions and Methods for the Electrodeposition of Nanotwinned CopperMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0580US11873568B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Granted Jan 16, 2024·0 cites·15 claims
- 0680US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 0777US11697884B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 0876US10544516B2Flexible color adjustment for dark Cr(III) platingsMACDERMID ENTHONE INC·Filed 2016·Granted Jan 28, 2020·1 cites·21 claims
- 0976US10519557B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2017·Granted Dec 31, 2019·2 cites·28 claims
- 1075US12540404B2Method for improving adhesion between metallization layers and ozone-etched plasticsMACDERMID ENTHONE INC·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 1173US12157944B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2023·Granted Dec 3, 2024·0 cites·37 claims
- 1270US11434578B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Sep 6, 2022·0 cites·28 claims
- 1369US12398480B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 26, 2025·0 cites·15 claims
- 1469US2024018678A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 1568US2025243596A1Composition and Method for Fabrication of Nickel InterconnectsMACDERMID ENTHONE INC·Filed 2025·Application pending·0 cites
- 1667US11643742B2Silver/tin electroplating bath and method of using the sameMACDERMID ENTHONE INC·Filed 2022·Granted May 9, 2023·0 cites·18 claims
- 1766US11846018B2Method and wet chemical compositions for diffusion barrier formationMACDERMID ENTHONE INC·Filed 2022·Granted Dec 19, 2023·0 cites·9 claims
- 1866US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 1966US10986738B2Carbon-based direct plating processMACDERMID ENTHONE INC·Filed 2018·Granted Apr 20, 2021·0 cites·16 claims
- 2065US10941496B2Near neutral pH pickle on multi-metalsMACDERMID ENTHONE INC·Filed 2019·Granted Mar 9, 2021·0 cites·10 claims
- 2165US2021371998A1Gold Plating Bath and Gold Plated Final FinishMACDERMID ENTHONE INC·Filed 2020·Application pending·0 cites
- 2264US12553134B2Bendable nickel plating on flexible substratesMACDERMID ENTHONE INC·Filed 2023·Granted Feb 17, 2026·0 cites·23 claims
- 2364US2021204412A1Carbon-Based Direct Plating ProcessMACDERMID ENTHONE INC·Filed 2021·Application pending·0 cites
- 2463US11280014B2Silver/tin electroplating bath and method of using the sameMACDERMID ENTHONE INC·Filed 2020·Granted Mar 22, 2022·0 cites·18 claims
- 2563US10995417B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted May 4, 2021·0 cites·20 claims
- 2663US10103029B2Process for filling vias in the microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted Oct 16, 2018·1 cites·27 claims
- 2763US2025137156A1Boric acid-free satin nickelMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 2863US2025188349A1Suppression of manganese dioxide formation in manganese (iii)-based etching solutionsMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 2961US2026078517A1Composition and method for nanotwinned copper formationMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 3060US11807951B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2021·Granted Nov 7, 2023·0 cites·16 claims
- 3159US11168406B2Leveler compositions for use in copper deposition in manufacture of microelectronicsMACDERMID ENTHONE INC·Filed 2019·Granted Nov 9, 2021·0 cites·31 claims
- 3257US12270121B2Composition and method for fabrication of nickel interconnectsMACDERMID ENTHONE INC·Filed 2020·Granted Apr 8, 2025·0 cites·19 claims
- 3357US10081876B2Aqueous electrolyte composition having a reduced airborne emission, method and use of this compositionMACDERMID ENTHONE INC·Filed 2014·Granted Sep 25, 2018·0 cites·25 claims
- 3456USRE49202ECopper electrodeposition in microelectronicsMACDERMID ENTHONE INC·Filed 2018·Granted Sep 6, 2022·0 cites·69 claims
- 3555US11230778B2Cobalt chemistry for smooth topologyMACDERMID ENTHONE INC·Filed 2019·Granted Jan 25, 2022·0 cites·21 claims
- 3654US2025137140A1Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devicesMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 3754US2022081776A1High Elongation Electroless Copper ProcessMACDERMID ENTHONE INC·Filed 2020·Application pending·0 cites
- 3852US12325927B2Complex waveform for electrolytic platingMACDERMID ENTHONE INC·Filed 2022·Granted Jun 10, 2025·0 cites·24 claims
- 3950US11124888B2Copper deposition in wafer level packaging of integrated circuitsMACDERMID ENTHONE INC·Filed 2017·Granted Sep 21, 2021·0 cites·17 claims
- 4049US2024318342A1Compositions and methods for the eletrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Application pending·0 cites
- 4148US2019390356A1Copper Electrodeposition in MicroelectronicsMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 4247US10508207B2Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrateMACDERMID ENTHONE INC·Filed 2016·Granted Dec 17, 2019·0 cites·23 claims
- 4347US2017350016A1Use of Water Soluble Lanthanide Compounds As Stabilizer In Electrolytes For Electroless Metal DepositionMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 4445US2023335496A1Process for Fabricating a 3D-NAND Flash MemoryMACDERMID ENTHONE INC·Filed 2021·Application pending·0 cites
- 4544US2019085461A1Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal depositionMACDERMID ENTHONE INC·Filed 2016·Application pending·0 cites
- 4643US11015255B2Selective plating of three dimensional surfaces to produce decorative and functional effectsMACDERMID ENTHONE INC·Filed 2018·Granted May 25, 2021·0 cites·20 claims
- 4743US2019112713A1Compressively Stressed Medium Phosphorus Electroless NickelMACDERMID ENTHONE INC·Filed 2017·Application pending·0 cites
- 4842US10828668B2Textured hardcoat filmsMACDERMID ENTHONE INC·Filed 2017·Granted Nov 10, 2020·0 cites·12 claims
- 4942US2018245178A1System and Method for Recovering Catalytic Precious Metal from Aqueous Galvanic Processing SolutionMACDERMID ENTHONE INC·Filed 2016·Application pending·0 cites
- 5041US2025051927A1Method of Metallization by a Nickel or Cobalt Alloy for the Manufacture of Semiconductor DevicesMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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