Inventor · disambiguated record
Todd Egan
Also filed as: EGAN TODD · EGAN TODD J · EGAN TODD JONATHAN
70 granted patents·23 pending applications·239 citations·filing 2006–2025
98Inventor score
Files withAPPLIED MATERIALS INC75HOLDEN JAMES M3LEI WEI-SHENG3RAVID ABRAHAM3CHOWDHURY MOHAMMAD KAMRUZZAMAN2
Top patents by PatentIndex Score
93 records- 0197US9157730B2PECVD processAPPLIED MATERIALS INC·Filed 2013·Granted Oct 13, 2015·49 cites·18 claims
- 0296US9458537B2PECVD processAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·12 cites·20 claims
- 0396US9029242B2Damage isolation by shaped beam delivery in laser scribing processHOLDEN JAMES M·Filed 2011·Granted May 12, 2015·25 cites·13 claims
- 0495US11856833B2In-line monitoring of OLED layer thickness and dopant concentrationAPPLIED MATERIALS INC·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0595US9816187B2PECVD processAPPLIED MATERIALS INC·Filed 2016·Granted Nov 14, 2017·8 cites·20 claims
- 0694US12265377B2Autonomous substrate processing systemAPPLIED MATERIALS INC·Filed 2023·Granted Apr 1, 2025·3 cites·17 claims
- 0794US11709477B2Autonomous substrate processing systemAPPLIED MATERIALS INC·Filed 2021·Granted Jul 25, 2023·3 cites·18 claims
- 0894US9405287B1Apparatus and method for optical calibration of wafer placement by a robotAPPLIED MATERIALS INC·Filed 2015·Granted Aug 2, 2016·11 cites·20 claims
- 0994US8969177B2Laser and plasma etch wafer dicing with a double sided UV-curable adhesive filmAPPLIED MATERIALS INC·Filed 2013·Granted Mar 3, 2015·17 cites·22 claims
- 1093US12098914B2Surface roughness and emissivity determinationAPPLIED MATERIALS INC·Filed 2022·Granted Sep 24, 2024·1 cites·20 claims
- 1193US11613812B2PECVD processAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·2 cites·20 claims
- 1293US8557682B2Multi-layer mask for substrate dicing by laser and plasma etchHOLDEN JAMES M·Filed 2011·Granted Oct 15, 2013·13 cites·15 claims
- 1390US10793954B2PECVD processAPPLIED MATERIALS INC·Filed 2018·Granted Oct 6, 2020·3 cites·13 claims
- 1490US10060032B2PECVD processAPPLIED MATERIALS INC·Filed 2017·Granted Aug 28, 2018·3 cites·20 claims
- 1588US10886155B2Optical stack deposition and on-board metrologyAPPLIED MATERIALS INC·Filed 2019·Granted Jan 5, 2021·7 cites·20 claims
- 1687US9870935B2Monitoring system for deposition and method of operation thereofAPPLIED MATERIALS INC·Filed 2015·Granted Jan 16, 2018·4 cites·7 claims
- 1786US11187654B2Imaging reflectometerAPPLIED MATERIALS INC·Filed 2020·Granted Nov 30, 2021·1 cites·20 claims
- 1886US9252057B2Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer applicationAPPLIED MATERIALS INC·Filed 2013·Granted Feb 2, 2016·7 cites·16 claims
- 1986US9177864B2Method of coating water soluble mask for laser scribing and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Nov 3, 2015·5 cites·10 claims
- 2085US11898249B2PECVD processAPPLIED MATERIALS INC·Filed 2023·Granted Feb 13, 2024·0 cites·17 claims
- 2185US11441992B2Method and apparatus for detection of particle size in a fluidAPPLIED MATERIALS INC·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 2285US8946057B2Laser and plasma etch wafer dicing using UV-curable adhesive filmAPPLIED MATERIALS INC·Filed 2013·Granted Feb 3, 2015·6 cites·29 claims
- 2382US11927535B2Metrology for OLED manufacturing using photoluminescence spectroscopyAPPLIED MATERIALS INC·Filed 2023·Granted Mar 12, 2024·0 cites·20 claims
- 2482US8859397B2Method of coating water soluble mask for laser scribing and plasma etchLEI WEI-SHENG·Filed 2013·Granted Oct 14, 2014·4 cites·20 claims
- 2581US10935492B2Metrology for OLED manufacturing using photoluminescence spectroscopyAPPLIED MATERIALS INC·Filed 2019·Granted Mar 2, 2021·1 cites·21 claims
- 2680US10816464B2Imaging reflectometerAPPLIED MATERIALS INC·Filed 2019·Granted Oct 27, 2020·2 cites·18 claims
- 2780US8078304B2Dual-mode robot systems and methods for electronic device manufacturingRICE MICHAEL R·Filed 2008·Granted Dec 13, 2011·10 cites·19 claims
- 2879US10281261B2In-situ metrology method for thickness measurement during PECVD processesAPPLIED MATERIALS INC·Filed 2016·Granted May 7, 2019·2 cites·16 claims
- 2979US8940619B2Method of diced wafer transportationLEI WEI-SHENG·Filed 2013·Granted Jan 27, 2015·3 cites·15 claims
- 3076US12492890B2In-situ reflectometry for real-time process controlAPPLIED MATERIALS INC·Filed 2023·Granted Dec 9, 2025·0 cites·19 claims
- 3176US10260855B2Electroplating tool with feedback of metal thickness distribution and correctionAPPLIED MATERIALS INC·Filed 2013·Granted Apr 16, 2019·2 cites·9 claims
- 3276US9620379B2Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Apr 11, 2017·3 cites·10 claims
- 3376US9048309B2Uniform masking for wafer dicing using laser and plasma etchCHOWDHURY MOHAMMAD KAMRUZZAMAN·Filed 2013·Granted Jun 2, 2015·5 cites·22 claims
- 3476US2023213444A1Methods and systems to measure properties of moving products in device manufacturing machinesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3576US2025125171A1Spatial pattern loading measurement with imaging metrologyAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3675US10196741B2Wafer placement and gap control optimization through in situ feedbackAPPLIED MATERIALS INC·Filed 2014·Granted Feb 5, 2019·3 cites·17 claims
- 3774US12225808B2In-line monitoring of OLED layer thickness and dopant concentrationAPPLIED MATERIALS INC·Filed 2023·Granted Feb 11, 2025·0 cites·15 claims
- 3874US2023060205A1Method and apparatus for detection of particle size in a fluidAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3973US10030306B2PECVD apparatus and processAPPLIED MATERIALS INC·Filed 2013·Granted Jul 24, 2018·1 cites·16 claims
- 4072US10710307B2Temperature control for additive manufacturingISHIKAWA DAVID MASAYUKI·Filed 2017·Granted Jul 14, 2020·1 cites·22 claims
- 4172US2025224228A1System and method to map thickness variations of substrates in manufacturing systemsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 4271US10695804B2Equipment cleaning apparatus and methodAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·1 cites·19 claims
- 4371US8912077B2Hybrid laser and plasma etch wafer dicing using substrate carrierSINGH SARAVJEET·Filed 2011·Granted Dec 16, 2014·2 cites·19 claims
- 4470US11662317B2Metrology for OLED manufacturing using photoluminescence spectroscopyAPPLIED MATERIALS INC·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 4570US9631919B2Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplatingAPPLIED MATERIALS INC·Filed 2013·Granted Apr 25, 2017·1 cites·10 claims
- 4669US12276490B2System and method to map thickness variations of substrates in manufacturing systemsAPPLIED MATERIALS INC·Filed 2022·Granted Apr 15, 2025·0 cites·24 claims
- 4768US8698889B2Metrology system for imaging workpiece surfaces at high robot transfer speedsRAVID ABRAHAM·Filed 2010·Granted Apr 15, 2014·3 cites·22 claims
- 4868US2025369897A1Polarized imaging reflectometerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4967US11609183B2Methods and systems to measure properties of products on a moving blade in electronic device manufacturing machinesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 21, 2023·0 cites·19 claims
- 5067US9218992B2Hybrid laser and plasma etch wafer dicing using substrate carrierAPPLIED MATERIALS INC·Filed 2014·Granted Dec 22, 2015·1 cites·16 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →