Inventor · disambiguated record
Jawahar P. Nayak
Also filed as: NAYAK JAWAHAR P · NAYAK JAWAHAR PUNDALIK
16 granted patents·3 pending applications·239 citations·filing 1997–2018
94Inventor score
Top patents by PatentIndex Score
19 records- 0189US6429482B1Halo-free non-rectifying contact on chip with halo source/drain diffusionIBM·Filed 2000·Granted Aug 6, 2002·46 cites·18 claims
- 0288US7067902B2Building metal pillars in a chip for structure supportIBM·Filed 2003·Granted Jun 27, 2006·42 cites·10 claims
- 0382US6972209B2Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2002·Granted Dec 6, 2005·32 cites·8 claims
- 0480US7456098B2Building metal pillars in a chip for structure supportIBM·Filed 2006·Granted Nov 25, 2008·8 cites·8 claims
- 0580US7448018B2System and method for employing patterning process statistics for ground rules waivers and optimizationIBM·Filed 2006·Granted Nov 4, 2008·9 cites·20 claims
- 0680US7138714B2Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal linesIBM·Filed 2005·Granted Nov 21, 2006·10 cites·10 claims
- 0772US10714411B2Interconnected integrated circuit (IC) chip structure and packaging and method of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 14, 2020·2 cites·19 claims
- 0866US6750109B2Halo-free non-rectifying contact on chip with halo source/drain diffusionIBM·Filed 2002·Granted Jun 15, 2004·11 cites·12 claims
- 0959US7962865B2System and method for employing patterning process statistics for ground rules waivers and optimizationIBM·Filed 2008·Granted Jun 14, 2011·1 cites·20 claims
- 1058US6341417B1Pre-patterned substrate layers for being personalized as neededIBM·Filed 1999·Granted Jan 29, 2002·19 cites·15 claims
- 1153US6238741B1Single mask screening processIBM·Filed 1998·Granted May 29, 2001·16 cites·21 claims
- 1252US6221193B1Defect reduction method for screened greensheets and article produced therefromIBM·Filed 1999·Granted Apr 24, 2001·20 cites·15 claims
- 1346US2006014376A1Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2005·Application pending·0 cites
- 1439US6231707B1Method of forming a multilayer ceramic substrate with max-punched viasIBM·Filed 1998·Granted May 15, 2001·8 cites·5 claims
- 1538US6475555B2Process for screening features on an electronic substrate with a low viscosity pasteIBM·Filed 1999·Granted Nov 5, 2002·7 cites·6 claims
- 1638US2002023779A1Pre-patterned substrate layers for being personalized as neededFiled 2001·Application pending·0 cites
- 1736US2001006116A1Single mask screening process and structure produced therebyIBM·Filed 2001·Application pending·0 cites
- 1833US5951917AConductive paste for large greensheet screening including high thixotropic agent contentIBM·Filed 1998·Granted Sep 14, 1999·6 cites·6 claims
- 1927US5783113AConductive paste for large greensheet screening including high thixotropic agent contentIBM·Filed 1997·Granted Jul 21, 1998·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →