Pre-patterned substrate layers for being personalized as needed

Abstract

A method and structure for personalizing a multi-layer substrate structure includes supplying a generic layer having electrical features and altering the electrical features to produce a personalized layer of the multi-layer substrate.

What is claimed is:  
     
         1 . A process for personalizing a multi-layer substrate structure comprising: 
 supplying a generic layer having electrical features; and    altering said electrical features to produce a personalized layer of said multi-layer substrate.    
     
     
         2 . The process in  claim 1 , wherein said altering comprises selectively filling vias in said generic layer with conductive material.  
     
     
         3 . The process in  claim 1 , wherein said altering comprises removing portions of electrical wiring on said generic layer.  
     
     
         4 . The process in  claim 1 , further comprising supplying a second generic layer identical to said generic layer and altering said electrical features of said second generic layer to produce a second personalized layer different than said personalized layer.  
     
     
         5 . The process in  claim 1 , wherein said altering changes said generic layer into a plurality of differently personalized layers.  
     
     
         6 . The process in  claim 1 , wherein said generic layer includes a grid of vias useful with a plurality of differently personalized layers.  
     
     
         7 . The process in  claim 1 , wherein said generic layer includes a pattern of wiring useful with a plurality of differently personalized layers.  
     
     
         8 . The process in  claim 1 , wherein said altering comprises selectively filling vias in said generic layer with an insulating material.  
     
     
         9 . The process in  claim 1 , wherein said altering comprises selectively forming insulating caps adjacent selected ones of conductive vias in said generic layer to render said selected ones of said conductive vias non-conductive.  
     
     
         10 . The process in  claim 9 , wherein said forming of said insulating caps comprises screening a insulating paste.  
     
     
         11 . The process in  claim 9 , wherein said forming of said insulating caps comprises placing dry insulating material over said selected ones of said conductive vias.  
     
     
         12 . A process for personalizing a multi-layer substrate structure comprising: 
 supplying a layer having generic electrical features; and    altering said generic electrical features to produce a personalized layer of said multi-layer substrate.    
     
     
         13 . The process in  claim 12 , wherein said altering comprises selectively filling vias in said layer with conductive material.  
     
     
         14 . The process in  claim 12 , wherein said altering comprises removing portions of electrical wiring on said layer.  
     
     
         15 . The process in  claim 12 , further comprising supplying a second layer identical to said layer and altering said generic electrical features of said second layer to produce a second personalized layer different than said personalized layer.  
     
     
         16 . The process in  claim 12 , wherein said altering changes said layer into a plurality of differently personalized layers.  
     
     
         17 . The process in  claim 12 , wherein said layer includes a generic grid of vias useful with a plurality of differently personalized layers.  
     
     
         18 . The process in  claim 12 , wherein said layer includes a generic pattern of wiring useful with a plurality of differently personalized layers.  
     
     
         19 . A multi-layer substrate structure comprising: 
 at least one layer having generic electrical features altered to personalize said layer.    
     
     
         20 . The multi-layer substrate structure in  claim 19 , wherein said electrical features include vias selectively filled with conductive material.  
     
     
         21 . The multi-layer substrate structure in  claim 19 , wherein said electrical features include a wiring pattern having portions selectively removed.  
     
     
         22 . The multi-layer substrate structure in  claim 19 , further comprising a second layer similar to said layer and having said generic electrical features altered differently than said layer to personalize said second layer differently than said layer.  
     
     
         23 . The multi-layer substrate structure in  claim 19 , wherein said layer is for being changes into a plurality of differently personalized layers.  
     
     
         24 . The multi-layer substrate structure in  claim 19 , wherein said layer includes a generic grid of vias useful with a plurality of differently personalized layers.  
     
     
         25 . The multi-layer substrate structure in  claim 19 , wherein said layer includes a generic pattern of wiring useful with a plurality of differently personalized layers.  
     
     
         26 . The multi-layer substrate structure in  claim 19 , further comprising: 
 conductive vias; and    insulating caps adjacent selected ones of said conductive vias, wherein said insulating caps render said selected ones of said conductive vias non-conductive.    
     
     
         27 . The multi-layer substrate structure in  claim 27 , wherein said insulating caps comprise a screened insulating paste.  
     
     
         28 . The multi-layer substrate structure in  claim 27 , wherein said insulating caps comprise a dry insulating material.