Inventor · disambiguated record
Barry Chin
Also filed as: CHIN BARRY · CHIN BARRY L · CHIN BARRY LEE
76 granted patents·18 pending applications·4,127 citations·filing 1983–2023
99Inventor score
Top patents by PatentIndex Score
94 records- 0199US10029405B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2017·Granted Jul 24, 2018·24 cites·13 claims
- 0299US9744724B2Apparatus for printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2016·Granted Aug 29, 2017·42 cites·20 claims
- 0399US9457520B2Apparatus for printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2015·Granted Oct 4, 2016·48 cites·16 claims
- 0499US9067299B2Printed chemical mechanical polishing padBAJAJ RAJEEV·Filed 2012·Granted Jun 30, 2015·60 cites·21 claims
- 0598US9829805B2Vapor deposition deposited photoresist, and manufacturing and lithography systems thereforAPPLIED MATERIALS INC·Filed 2016·Granted Nov 28, 2017·14 cites·12 claims
- 0698US9632411B2Vapor deposition deposited photoresist, and manufacturing and lithography systems thereforAPPLIED MATERIALS INC·Filed 2013·Granted Apr 25, 2017·26 cites·8 claims
- 0797US7253109B2Method of depositing a tantalum nitride/tantalum diffusion barrier layer systemAPPLIED MATERIALS INC·Filed 2005·Granted Aug 7, 2007·44 cites·67 claims
- 0897US6919275B2Method of preventing diffusion of copper through a tantalum-comprising barrier layerAPPLIED MATERIALS INC·Filed 2004·Granted Jul 19, 2005·87 cites·4 claims
- 0997US6620956B2Nitrogen analogs of copper II β-diketonates as source reagents for semiconductor processingAPPLIED MATERIALS INC·Filed 2002·Granted Sep 16, 2003·69 cites·10 claims
- 1097US5238499AGas-based substrate protection during processingNOVELLUS SYSTEMS INC·Filed 1991·Granted Aug 24, 1993·411 cites·23 claims
- 1196US7081271B2Cyclical deposition of refractory metal silicon nitrideAPPLIED MATERIALS INC·Filed 2002·Granted Jul 25, 2006·124 cites·57 claims
- 1296US6436267B1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·105 cites·35 claims
- 1396US6328871B1Barrier layer for electroplating processesAPPLIED MATERIALS INC·Filed 1999·Granted Dec 11, 2001·161 cites·12 claims
- 1496US6287977B1Method and apparatus for forming improved metal interconnectsAPPLIED MATERIALS INC·Filed 1998·Granted Sep 11, 2001·161 cites·18 claims
- 1596US6066892ACopper alloy seed layer for copper metallization in an integrated circuitAPPLIED MATERIALS INC·Filed 1998·Granted May 23, 2000·185 cites·20 claims
- 1696US4479831AMethod of making low resistance polysilicon gate transistors and low resistance interconnections therefor via gas deposited in-situ doped amorphous layer and heat-treatmentBURROUGHS CORP·Filed 1983·Granted Oct 30, 1984·565 cites·8 claims
- 1795US11673225B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2021·Granted Jun 13, 2023·1 cites·17 claims
- 1895US11207758B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2020·Granted Dec 28, 2021·2 cites·21 claims
- 1994US10843306B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2018·Granted Nov 24, 2020·3 cites·23 claims
- 2094US7085616B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2001·Granted Aug 1, 2006·42 cites·39 claims
- 2194US6758947B2Damage-free sculptured coating depositionAPPLIED MATERIALS INC·Filed 2001·Granted Jul 6, 2004·47 cites·29 claims
- 2294US6559061B2Method and apparatus for forming improved metal interconnectsAPPLIED MATERIALS INC·Filed 2001·Granted May 6, 2003·63 cites·16 claims
- 2394US6160315ACopper alloy via structureAPPLIED MATERIALS INC·Filed 2000·Granted Dec 12, 2000·73 cites·24 claims
- 2493US7048837B2End point detection for sputtering and resputteringAPPLIED MATERIALS INC·Filed 2003·Granted May 23, 2006·68 cites·26 claims
- 2593US6709987B2Method and apparatus for forming improved metal interconnectsAPPLIED MATERIALS INC·Filed 2002·Granted Mar 23, 2004·55 cites·25 claims
- 2693US6037257ASputter deposition and annealing of copper alloy metallizationAPPLIED MATERIALS INC·Filed 1997·Granted Mar 14, 2000·117 cites·15 claims
- 2792US8027746B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2010·Granted Sep 27, 2011·4 cites·15 claims
- 2892US7381639B2Method of depositing a metal seed layer on semiconductor substratesAPPLIED MATERIALS INC·Filed 2006·Granted Jun 3, 2008·10 cites·13 claims
- 2991US9390970B2Method for depositing a diffusion barrier layer and a metal conductive layerCHIANG TONY·Filed 2007·Granted Jul 12, 2016·10 cites·69 claims
- 3090US7074714B2Method of depositing a metal seed layer on semiconductor substratesAPPLIED MATERIALS INC·Filed 2004·Granted Jul 11, 2006·26 cites·3 claims
- 3190US5230741AGas-based backside protection during substrate processingNOVELLUS SYSTEMS INC·Filed 1990·Granted Jul 27, 1993·118 cites·34 claims
- 3289US7860597B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2009·Granted Dec 28, 2010·5 cites·19 claims
- 3389US6790776B2Barrier layer for electroplating processesAPPLIED MATERIALS INC·Filed 2001·Granted Sep 14, 2004·34 cites·19 claims
- 3489US6566259B1Integrated deposition process for copper metallizationAPPLIED MATERIALS INC·Filed 2000·Granted May 20, 2003·41 cites·27 claims
- 3589US6458255B2Ultra-low resistivity tantalum films and methods for their depositionAPPLIED MATERIALS INC·Filed 2001·Granted Oct 1, 2002·32 cites·4 claims
- 3689US6139699ASputtering methods for depositing stress tunable tantalum and tantalum nitride filmsAPPLIED MATERIALS INC·Filed 1997·Granted Oct 31, 2000·72 cites·14 claims
- 3789US5882417AApparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition apparatusNOVELLUS SYSTEMS INC·Filed 1996·Granted Mar 16, 1999·90 cites·2 claims
- 3888US8626330B2Atomic layer deposition apparatusCHIN BARRY L·Filed 2011·Granted Jan 7, 2014·4 cites·14 claims
- 3988US6992012B2Method and apparatus for forming improved metal interconnectsAPPLIED MATERIALS INC·Filed 2004·Granted Jan 31, 2006·35 cites·33 claims
- 4088US5620525AApparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrateNOVELLUS SYSTEMS INC·Filed 1994·Granted Apr 15, 1997·114 cites·47 claims
- 4187US12011801B2Printing a chemical mechanical polishing padAPPLIED MATERIALS INC·Filed 2023·Granted Jun 18, 2024·0 cites·13 claims
- 4286US7660644B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2006·Granted Feb 9, 2010·4 cites·10 claims
- 4386US6235163B1Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performanceAPPLIED MATERIALS INC·Filed 1999·Granted May 22, 2001·54 cites·14 claims
- 4485US6605197B1Method of sputtering copper to fill trenches and viasAPPLIED MATERIALS INC·Filed 1997·Granted Aug 12, 2003·57 cites·14 claims
- 4585US6399479B1Processes to improve electroplating fillAPPLIED MATERIALS INC·Filed 1999·Granted Jun 4, 2002·74 cites·20 claims
- 4685US5925411AGas-based substrate deposition protectionNOVELLUS SYSTEMS INC·Filed 1995·Granted Jul 20, 1999·72 cites·37 claims
- 4785US5578532AWafer surface protection in a gas deposition processNOVELLUS SYSTEMS INC·Filed 1994·Granted Nov 26, 1996·91 cites·20 claims
- 4884US9031685B2Atomic layer deposition apparatusAPPLIED MATERIALS INC·Filed 2014·Granted May 12, 2015·1 cites·19 claims
- 4983US7892602B2Cyclical deposition of refractory metal silicon nitrideAPPLIED MATERIALS INC·Filed 2006·Granted Feb 22, 2011·7 cites·41 claims
- 5083US7687909B2Metal / metal nitride barrier layer for semiconductor device applicationsAPPLIED MATERIALS INC·Filed 2007·Granted Mar 30, 2010·7 cites·13 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →