Inventor · disambiguated record
Larry Jacobsen
Also filed as: JACOBSEN LARRY · JACOBSEN LARRY L
7 granted patents·207 citations·filing 1997–2012
87Inventor score
Technology areasH10W
Files withVERTICAL CIRCUITS INC3LSI LOGIC CORP2INVENSAS CORP1VERTICAL CIRCUITS ASSIGNMENT FOR THE BENEFIT OF CREDITORS LLC1
Top patents by PatentIndex Score
7 records- 0195US7215018B2Stacked die BGA or LGA component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted May 8, 2007·80 cites·14 claims
- 0294US7535109B2Die assembly having electrical interconnectVERTICAL CIRCUITS INC·Filed 2007·Granted May 19, 2009·38 cites·54 claims
- 0394US7245021B2Micropede stacked die component assemblyVERTICAL CIRCUITS INC·Filed 2005·Granted Jul 17, 2007·59 cites·12 claims
- 0483US8357999B2Assembly having stacked die mounted on substrateVERTICAL CIRCUITS ASSIGNMENT FOR THE BENEFIT OF CREDITORS LLC·Filed 2007·Granted Jan 22, 2013·14 cites·92 claims
- 0552US8729690B2Assembly having stacked die mounted on substrateINVENSAS CORP·Filed 2012·Granted May 20, 2014·0 cites·19 claims
- 0646US6130113AEnhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly processLSI LOGIC CORP·Filed 1998·Granted Oct 10, 2000·14 cites·9 claims
- 0730US5973398ASemiconductor device and fabrication method employing a palladium-plated heat spreader substrateLSI LOGIC CORP·Filed 1997·Granted Oct 26, 1999·2 cites·22 claims
Join the waitlist — get patent alerts
Get an alert when Larry Jacobsen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →