Inventor · disambiguated record
Hirohisa Matsuki
Also filed as: MATSUKI HIROHISA
48 granted patents·5 pending applications·2,024 citations·filing 1990–2017
99Inventor score
Files withFUJITSU LTD36FUJITSU SEMICONDUCTOR LTD4MATSUKI HIROHISA4FUJITSU MICROELECTRONICS LTD3MATSUI HIROYUKI2
Top patents by PatentIndex Score
53 records- 0196US5969424ASemiconductor device with pad structureFUJITSU LTD·Filed 1997·Granted Oct 19, 1999·258 cites·11 claims
- 0295US7084513B2Semiconductor device having a plurality of semiconductor chips and method for manufacturing the sameFUJITSU LTD·Filed 2004·Granted Aug 1, 2006·91 cites·14 claims
- 0395US6548898B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2001·Granted Apr 15, 2003·98 cites·28 claims
- 0495US6344407B1Method of manufacturing solder bumps and solder joints using formic acidFUJITSU LTD·Filed 2000·Granted Feb 5, 2002·75 cites·25 claims
- 0594US8952538B2Semiconductor device and method for manufacturing the sameMATSUKI HIROHISA·Filed 2010·Granted Feb 10, 2015·16 cites·9 claims
- 0694US5065223APackaged semiconductor deviceFUJITSU VLSI LTD·Filed 1990·Granted Nov 12, 1991·211 cites·10 claims
- 0793US7064436B2Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·81 cites·2 claims
- 0892US8395260B2Semiconductor device and manufacturing method thereofMATSUKI HIROHISA·Filed 2011·Granted Mar 12, 2013·12 cites·7 claims
- 0992US7550844B2Semiconductor device and manufacturing method thereofFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Jun 23, 2009·18 cites·9 claims
- 1092US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 1192US6232147B1Method for manufacturing semiconductor device with pad structureFUJITSU LTD·Filed 1999·Granted May 15, 2001·133 cites·11 claims
- 1292US6218281B1Semiconductor device with flip chip bonding pads and manufacture thereofFUJITSU LTD·Filed 1998·Granted Apr 17, 2001·162 cites·29 claims
- 1391US7064645B2Electronic deviceFUJITSU LTD·Filed 2002·Granted Jun 20, 2006·46 cites·10 claims
- 1490US6836025B2Semiconductor device configured to be surface mountableFUJITSU LTD·Filed 2003·Granted Dec 28, 2004·61 cites·16 claims
- 1589US7112889B1Semiconductor device having an alignment mark formed by the same material with a metal postFUJITSU LTD·Filed 2000·Granted Sep 26, 2006·36 cites·9 claims
- 1689US6455920B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Sep 24, 2002·72 cites·3 claims
- 1788US6666369B2Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipmentFUJITSU LTD·Filed 2001·Granted Dec 23, 2003·34 cites·18 claims
- 1887US7405137B2Method of dicing a semiconductor substrate into a plurality of semiconductor chips by forming two cutting grooves on one substrate surface and forming one cutting groove on an opposite substrate surface that overlaps the two cutting groovesFUJITSU LTD·Filed 2005·Granted Jul 29, 2008·12 cites·12 claims
- 1987US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 2086US6939142B2Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact pieceFUJITSU LTD·Filed 2000·Granted Sep 6, 2005·30 cites·10 claims
- 2186US6909181B2Light signal processing systemFUJITSU LTD·Filed 2002·Granted Jun 21, 2005·34 cites·15 claims
- 2285US7556985B2Method of fabricating semiconductor deviceFUJITSU MICROELECTRONICS LTD·Filed 2005·Granted Jul 7, 2009·9 cites·1 claims
- 2385US6732911B2Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing systemFUJITSU LTD·Filed 2001·Granted May 11, 2004·35 cites·39 claims
- 2484US6680241B2Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devicesFUJITSU LTD·Filed 2000·Granted Jan 20, 2004·40 cites·7 claims
- 2584US6566239B2Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless platingFUJITSU LTD·Filed 2001·Granted May 20, 2003·38 cites·6 claims
- 2683US6784543B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·30 cites·35 claims
- 2782US7759246B2Semiconductor device having a plurality of semiconductor chips and method for manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jul 20, 2010·9 cites·8 claims
- 2881US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 2980US6657282B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2002·Granted Dec 2, 2003·19 cites·15 claims
- 3078US7863745B2Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Jan 4, 2011·8 cites·7 claims
- 3178US7064047B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·16 cites·9 claims
- 3277US6784542B2Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·15 cites·10 claims
- 3377US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 3477US6471501B1Mold for fabricating semiconductor devicesFUJITSU LTD·Filed 1999·Granted Oct 29, 2002·53 cites·14 claims
- 3576US7240432B2Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact pieceFUJITSU LTD·Filed 2005·Granted Jul 10, 2007·4 cites·9 claims
- 3673US6987054B2Method of fabricating a semiconductor device having a groove formed in a resin layerFUJITSU LTD·Filed 2002·Granted Jan 17, 2006·12 cites·10 claims
- 3771US8759119B2Method of testing a semiconductor device and suctioning a semiconductor device in the wafer stateFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Jun 24, 2014·2 cites·4 claims
- 3869US8490857B2Reflow apparatus, a reflow method, and a manufacturing method of a semiconductor deviceMATSUI HIROYUKI·Filed 2012·Granted Jul 23, 2013·2 cites·5 claims
- 3968US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 4066US8084277B2Semiconductor device and manufacturing method thereofMATSUKI HIROHISA·Filed 2009·Granted Dec 27, 2011·2 cites·6 claims
- 4159US9893029B2Semiconductor device and method for manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Feb 13, 2018·0 cites·13 claims
- 4258US11004817B2Semiconductor device and method for manufacturing the sameSOCIONEXT INC·Filed 2017·Granted May 11, 2021·0 cites·16 claims
- 4358US7233076B2Semiconductor device with read out prevention and method of producing sameFUJITSU LTD·Filed 2004·Granted Jun 19, 2007·7 cites·9 claims
- 4453US8404496B2Method of testing a semiconductor device and suctioning a semiconductor device in the wafer stateMARUYAMA SHIGEYUKI·Filed 2006·Granted Mar 26, 2013·1 cites·2 claims
- 4548US8336756B2Reflow apparatus, a reflow method, and a manufacturing method of semiconductor deviceMATSUI HIROYUKI·Filed 2006·Granted Dec 25, 2012·0 cites·11 claims
- 4647US8994153B2Semiconductor device having antenna element and method of manufacturing sameMATSUKI HIROHISA·Filed 2012·Granted Mar 31, 2015·0 cites·12 claims
- 4746US5633532ASemiconductor device interconnectionFUJITSU LTD·Filed 1995·Granted May 27, 1997·17 cites·8 claims
- 4846US2006258045A1Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4941US2005074971A1Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
- 5040US6734042B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2002·Granted May 11, 2004·0 cites·8 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →