Semiconductor device and method for fabricating the same

Abstract

A group of wires that bonds the first semiconductor chip and the second semiconductor chip together and extends on the first semiconductor chip is formed of a single plated film through plating in one continuous process. The second semiconductor chip is then bonded onto the first semiconductor chip to complete a semiconductor package.

1 . A semiconductor device comprising: 
 a first semiconductor chip,    a second semiconductor chip bonded onto the first semiconductor chip, and    a single electrically conductive film, extending on an element-formed surface of the first semiconductor chip, electrically connecting between the first semiconductor chip and the second semiconductor chip.    
   
   
       2 . The semiconductor device according to  claim 1 , wherein the conductive film is a plated film.  
   
   
       3 . The semiconductor device according to  claim 1 , wherein the conductive film also serves as a lead wire of the first semiconductor chip.  
   
   
       4 . The semiconductor device according to  claim 1 , wherein an adhesive resin that has been used for temporarily fixing both the semiconductor chips remains on a surface of the second semiconductor chip opposite to the first semiconductor chip.