Inventor · disambiguated record
Christine Hau-Riege
Also filed as: HAU RIEGE CHRISTINE · HAU-RIEGE CHRISTINE S · HAU-RIEGE CHRISTINE SUNG-AN
24 granted patents·5 pending applications·433 citations·filing 2001–2020
96Inventor score
Top patents by PatentIndex Score
29 records- 0193US6518184B1Enhancement of an interconnectINTEL CORP·Filed 2002·Granted Feb 11, 2003·61 cites·20 claims
- 0292US6667225B2Wafer-bonding using solder and method of making the sameINTEL CORP·Filed 2001·Granted Dec 23, 2003·68 cites·18 claims
- 0391US6822437B1Interconnect test structure with slotted feeder lines to prevent stress-induced voidsADVANCED MICRO DEVICES INC·Filed 2003·Granted Nov 23, 2004·53 cites·32 claims
- 0490US7451411B2Integrated circuit design systemADVANCED MICRO DEVICES INC·Filed 2006·Granted Nov 11, 2008·23 cites·20 claims
- 0585US6822473B1Determination of permeability of layer material within interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 23, 2004·28 cites·25 claims
- 0684US6867056B1System and method for current-enhanced stress-migration testing of interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 15, 2005·31 cites·16 claims
- 0782US6818557B1Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 16, 2004·28 cites·20 claims
- 0882US6725433B1Method for assessing the reliability of interconnectsADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 20, 2004·26 cites·20 claims
- 0981US6762597B1Structure, system, and method for assessing electromigration permeability of layer material within interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 13, 2004·25 cites·26 claims
- 1081US6714037B1Methodology for an assessment of the degree of barrier permeability at via bottom during electromigration using dissimilar barrier thicknessADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 30, 2004·23 cites·33 claims
- 1180US9171782B2Stacked redistribution layers on dieQUALCOMM INC·Filed 2013·Granted Oct 27, 2015·6 cites·32 claims
- 1278US9972624B2Layout construction for addressing electromigrationQUALCOMM INC·Filed 2013·Granted May 15, 2018·4 cites·20 claims
- 1375US10600785B2Layout construction for addressing electromigrationQUALCOMM INC·Filed 2018·Granted Mar 24, 2020·2 cites·12 claims
- 1472US7135775B2Enhancement of an interconnectINTEL CORP·Filed 2002·Granted Nov 14, 2006·12 cites·8 claims
- 1572US6897476B1Test structure for determining electromigration and interlayer dielectric failureADVANCED MICRO DEVICES INC·Filed 2003·Granted May 24, 2005·15 cites·9 claims
- 1664US11508725B2Layout construction for addressing electromigrationQUALCOMM INC·Filed 2020·Granted Nov 22, 2022·0 cites·9 claims
- 1764US7153774B2Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliabilityINTEL CORP·Filed 2002·Granted Dec 26, 2006·14 cites·12 claims
- 1862US7818655B1Method for quantitative detection of multiple electromigration failure modesADVANCED MICRO DEVICES INC·Filed 2006·Granted Oct 19, 2010·1 cites·20 claims
- 1958US7026225B1Semiconductor component and method for precluding stress-induced void formation in the semiconductor componentADVANCED MICRO DEVICES INC·Filed 2003·Granted Apr 11, 2006·8 cites·18 claims
- 2049US8482125B2Conductive sidewall for microbumpsCHANDRASEKARAN ARVIND·Filed 2010·Granted Jul 9, 2013·0 cites·6 claims
- 2149US2013105559A1Conductive sidewall for microbumpsQUALCOMM INC·Filed 2012·Application pending·0 cites
- 2248US6870262B2Wafer-bonding using solder and method of making the sameINTEL CORP·Filed 2003·Granted Mar 22, 2005·2 cites·3 claims
- 2347US2019043817A1Land grid based multi size pad packageQUALCOMM INC·Filed 2018·Application pending·0 cites
- 2446US6768323B1System and method for determining location of extrusion in interconnectADVANCED MICRO DEVICES INC·Filed 2002·Granted Jul 27, 2004·3 cites·20 claims
- 2543US2007278484A1Method and test structure for estimating electromigration effects caused by porous barrier materialsFEUSTEL FRANK·Filed 2007·Application pending·0 cites
- 2643US2018053740A1Land grid based multi size pad packageQUALCOMM INC·Filed 2016·Application pending·0 cites
- 2737US9941156B2Systems and methods to reduce parasitic capacitanceQUALCOMM INC·Filed 2015·Granted Apr 10, 2018·0 cites·16 claims
- 2835US8723321B2Copper interconnects with improved electromigration lifetimeWOO CHRISTY·Filed 2006·Granted May 13, 2014·0 cites·20 claims
- 2935US2003194857A1Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliabilityFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →